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Conference
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2024 |
Evaluation of Solder-Join Repair on Glass Interposers for CPO Optical Module Maintenance Solutions
권상진
Photonics Conference 2024, pp.1-2 |
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Conference
|
2024 |
Study on EAM current characteristics corresponding to the optical power of the 2x4 lambda LWDM EMLs
권원배
Photonics Conference 2024, pp.1-2 |
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Conference
|
2024 |
Design of an 800 Gbps Silicon Photonics based Optical Engine
유상화
광전자 및 광통신 학술 회의 (COOC) 2024, pp.1-1 |
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Journal
|
2024 |
Compact lithium niobate plasmonic modulator
Myunghwan Kim
Optics Letters, v.49, no.4, pp.939-942 |
0 |
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Conference
|
2023 |
A Study of the Laser Soldering Process for High-frequency PCB Substrate
권상진
Photonics Conference 2023, pp.1-2 |
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Conference
|
2023 |
TEC power consumption analysis of the 2x4 lambda LWDM EML TOSA module
권원배
Photonics Conference 2023, pp.1-2 |
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Conference
|
2023 |
Wavelength change of 2x4 LWDM EML TOSA depending on TEC cooling condition
정수용
Photonics Conference 2023, pp.1-2 |
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Conference
|
2023 |
Fabrication and analysis of TGV(Through glass via) for Co-Packaged Optics
강은규
Photonics Conference 2023, pp.1-2 |
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Conference
|
2023 |
100 Gbps Fully-Integrated Silicon Photonics Transmitter Technology
유상화
광전자 및 광통신 학술 회의 (COOC) 2023, pp.1-1 |
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Conference
|
2023 |
Implementation of silicon photonics-in-package (SiP) based 100Gbps PAM-4 optical transceiver and its key technologies
Jyung Chan Lee
광전자 및 광통신 학술 회의 (COOC) 2023, pp.1-2 |
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Conference
|
2023 |
Implementation of silicon photonics-in-package (SiP) based 100Gbps PAM-4 chip-on-board (COB) and optical transceiver
Jyung Chan Lee
한국광학회 학술 발표회 (동계) 2023, pp.1-1 |
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Conference
|
2022 |
Four Wave Mixing Effect on O-bnad LWDM4 Wavelength of PAM4-106Gbps Modulated Signal
정수용
Photonics Conference 2022, pp.1-2 |
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Journal
|
2022 |
53 GBd PAM-4 fully-integrated silicon photonics transmitter with a hybrid flip-chip bonded laser
Sanghwa Yoo
Optics Express, v.30, no.23, pp.41980-41998 |
5 |
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Conference
|
2022 |
TEC power consumption of the 8 channel EML TOSA module
권원배
Photonics Conference 2022, pp.1-2 |
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Conference
|
2022 |
Non-contact High Speed POB Solder Joint Process Using Laser Heating
권상진
Photonics Conference 2022, pp.1-2 |
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Conference
|
2022 |
Chip-On-Board Implementation of 106Gb/s PAM4 Silicon Photonics Transmit and Receive and its Real-Time Operation
Jyung Chan Lee
Optics and Photonics Congress 2022, pp.1-1 |
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Conference
|
2022 |
Implementation of Low Power Consumption Optical Transmitter Module Platform
강은규
광전자 및 광통신 학술 회의 (COOC) 2022, pp.1-1 |
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Conference
|
2022 |
100 Gbps Silicon Photonics Transmitter Technology
유상화
광전자 및 광통신 학술 회의 (COOC) 2022, pp.1-1 |
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Conference
|
2021 |
Thermal Characteristic of the 800Gbps Non-hermetic Package
권원배
Photonics Conference 2021, pp.1-2 |
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Conference
|
2021 |
Transmitter Optical Engine with Glass Interposer
김대선
Photonics Conference 2021, pp.1-2 |
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Conference
|
2021 |
A Study on the Method of Measuring Internal Humidity in Non-hermetic Packages
정수용
Photonics Conference 2021, pp.1-2 |
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Conference
|
2020 |
Electrode Interconnection of Glass VIA and Ceramic Optical-bench by using localized Laser Heating for High-speed Optical Communication Module
권상진
Photonics Conference 2020, pp.1-2 |
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Conference
|
2020 |
60GHz Glass interposer for optoelectronics packaging
김대선
광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2 |
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Conference
|
2020 |
Thermal characteristics of TO package and flat package for cooled TOSA
권원배
광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2 |
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Conference
|
2020 |
90 degree wire bonding for 100 Gbps ROSA platform
강은규
광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2 |
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Conference
|
2018 |
A Study on the 100Gbps CWDM4 TOSA Platform
정수용
한국통신학회 종합 학술 발표회 (하계) 2018, pp.1476-1477 |
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