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Bae Hyun-Cheol
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Type Year Title Cited Download
Conference
2024 Results of SiC and GaN Power Module Manufacturing with Non-Pressure Ag Sintering Paste   오애선   SiC 반도체 컨퍼런스 2024, pp.53-53
Conference
2024 Improved thermal shock reliability of AlN substrates with high heat dissipation for electric vehicles   배현철   SiC 반도체 컨퍼런스 2024, pp.52-52
Conference
2023 Manufacturing of power module using base plate integrated Insulted metal substrate   배현철   한국전기전자재료학회 학술 대회 (하계) 2023, pp.1-1
Conference
2023 Analysis of Heat Dissipation Characteristics of Power Modules with Different Top Metal and Bottom Metal Thicknesses of Insulated Metal Substrate   박성효  대한전자공학회 학술 대회 (하계) 2023, pp.116-119
Journal
2023 Thermal Design of High Power Semiconductor Using Insulated Metal Substrate   정봉민   마이크로전자 및 패키징학회지, v.30, no.1, pp.63-70
Conference
2023 Thermal-Electrical Co-Simulation for Package Heat Dissipation Design   Bongmin Jeong   한국반도체 학술대회 (KCS) 2023, pp.1-1
Conference
2023 Measurement and comparison of low dielectric constant and loss characteristics of PCB material for 5G and Ka band   배현철   한국전자파학회 종합 학술 대회 (동계) 2023, pp.250-250
Conference
2022 Effect of Carbon Fiber and Glass Fiber on Thermo-mechanical Property of Polyether Ether Ketone for Power Module case of Electric Vehicle   손기락   한국복합재료학회 학술 발표 대회 (추계) 2022, pp.197-197
Journal
2022 Thermal shock reliability of micro–nano bimodal Cu–Ag sintered joints   Kirak Son   Journal of Materials Science : Materials in Electronics, v.33, pp.17493-17501 2
Conference
2022 Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate   Bongmin Jeong   International Conference and Exhibition on High Temperature Electronics Network (HiTEN) 2022, pp.66-70
Conference
2022 Thermal Dissipation Characteristics of Insulated Metal Substrate for SiC Power Conversion Module   배현철   한국전기전자재료학회 학술 대회 (하계) 2022, pp.1-1
Conference
2022 Correlation between the Mechanical Strength and Crystallinity of 3D- Printed PEEK Materials   Kyung-Hyun Kim   Materials Research Society (MRS) Meeting 2022 (Spring), pp.1-1
Conference
2022 A Study on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on DBC/AMB Substrates for Power Module   Kirak Son   한국반도체 학술대회 (KCS) 2022, pp.369-369
Conference
2022 DBC and IMS for Electric Vehicle Power Module Heat Dissipation Comparsion   정봉민   한국반도체 학술대회 (KCS) 2022, pp.427-427
Conference
2021 Measurement of PCB ielectric constant and loss using T-resonatorin the millimeter wave band   박은영   대한전자공학회 학술 대회 (추계) 2021, pp.90-92
Conference
2021 Effect of Sintering Process on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on Power Electronics Substrate   Kirak Son   International Symposium on Microelectronics and Packaging (ISMP) 2021, pp.1-1
Conference
2021 Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material   Dong-Hwan Kim   Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 4
Journal
2021 Fabrication of Cu Wiring Touch Sensor via Laser Sintering of Cu Nano/Microparticle Paste on 3D‐Printed Substrate   Hyeon-Sik Ahn   Advanced Engineering Materials, v.23, no.1, pp.1-9 3
Conference
2021 Fabrication of Cu Trace Touch Sensor by Laser Sintering of Cu Micro-Nano Particle Paste on 3D -printed Substrate   안현식   한국 반도체 학술 대회 (KCS) 2021, pp.512-512
Conference
2021 TO 247 module manufacture and Characteristic measurement using high heat dissipation bonding material   오애선   한국 반도체 학술 대회 (KCS) 2021, pp.432-432
Conference
2021 Thermal analysis of SiC power module using high heat dissipation DBC/AMB substrate and bonding material with high thermal conductivity   김동환   한국 반도체 학술 대회 (KCS) 2021, pp.258-258
Conference
2021 Pressureless bonding of high heat dissipation nano/micron Cu Sintering Paste for SiC power module   배현철   한국 반도체 학술 대회 (KCS) 2021, pp.255-255
Conference
2020 High heat dissipation bonding for power semiconductors   배현철   대한전자공학회 학술 대회 (하계) 2020, pp.167-169
Conference
2020 Thermal analysis of power module using high heat dissipation substrate and bonding material   김동환   대한전자공학회 학술 대회 (하계) 2020, pp.151-154
Journal
2019 Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications   Yong-Sung Eom   ETRI Journal, v.41, no.6, pp.820-828 8
Conference
2019 Cu sintering paste for EV power module   Hyuncheol Bae   International Conference on Advanced Electromaterials (ICAE) 2019, pp.1-1
Conference
2019 Low Temperature Bonding for Transparent Hydrogenated Amorphous Silicon Solar Cell   Hyun-Cheol Bae   Global Photovoltaic Conference (GPVC) 2019, pp.219-219
Conference
2019 Development of high thermal Cu sintering paste for EV module   배현철   SiC 반도체 컨퍼런스 2019, pp.1-1
Conference
2019 Bonding process for transparent Solar Cell Based on Silicon Thin Film   오애선   한국 반도체 학술 대회 (KCS) 2019, pp.524-524
Conference
2019 Development of high heat-dissipating Cu-based bonding material and power module for electric vehicles   배현철   한국 반도체 학술 대회 (KCS) 2019, pp.264-264
Conference
2018 Bonding process for large-area transparent solar cell based on silicon thin-film   배현철   한국태양광발전학회 학술 대회 (추계) 2018, pp.249-249
Conference
2018 Bonding of Amorphous Silicon Thin Film Solar Cell Using Glass Frit Paste   배현철   한국태양광발전학회 학술 대회 (추계) 2018, pp.250-250
Conference
2018 Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste   In-Hoo Kim   International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4
Journal
2018 Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging   Keon-Soo Jang   Polymer International, v.67, no.9, pp.1241-1247 21
Journal
2018 Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis   Keon-Soo Jang   Journal of Applied Polymer Science, v.135, no.33, pp.1-9 16
Conference
2018 Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2018, pp.1561-1567 15
Journal
2018 Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection   Keon-Soo Jang   Industrial & Engineering Chemistry Research, v.57, no.21, pp.7181-7187 11
Conference
2018 Quantifying Fluxing Capability of NCP and NCF   장건수   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2018, pp.33-33
Conference
2017 Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser   Kwang-Seong Choi   International Microelectronics Assembly and Packaging Society (IMAPS) 2017, pp.1-5
Conference
2017 Silica Filler Content in NCP and its Effects on the Reliability of 3D TSV Multi-Stack under Thermal Shock Test   Wagno Alves Braganca Junior   Electronics Packaging Technology Conference (EPTC) 2017, pp.1-8 7
Journal
2017 Hidden Innovations in the Fourth Industrial Revolution: Electronic Packaging Technology   최광성   전자통신동향분석, v.32, no.6, pp.17-26
Conference
2017 Micro Thermoelectric Cooler for Optical Transmitter using Silicon Substrate   Hyun-cheol Bae   International Conference on Advanced Electromaterials (ICAE) 2017, pp.1-1
Conference
2017 Design and Fabrication of MCT Modules for the Firing Unit   배현철   한국군사과학기술학회 종합 학술 대회 (추계) 2017, pp.1035-1036
Conference
2017 Solvent-free Fluxing Underfill Film for Electrical Interconnection   Keon-Soo Jang   European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 3
Conference
2017 Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging   Yong-Sung EOM   European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 0
Conference
2017 Al wire bonding process of Power Semiconductor packaging process   오애선   대한전자공학회 종합 학술 대회 (하계) 2017, pp.229-231
Conference
2017 Power Device Packaging for Electric Vehicle   배현철   대한전자공학회 종합 학술 대회 (하계) 2017, pp.1663-1664
Conference
2017 Micro Thermoelectric Cooler for Optical Transmitter   배현철   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2017, pp.38-38
Journal
2016 Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding   Haksun Lee   ETRI Journal, v.38, no.6, pp.1163-1171 13
Journal
2016 Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications   Eom Yong-Sung   ETRI Journal, v.38, no.6, pp.1179-1189 4
Journal
2016 Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate   Hyun-Cheol Bae   Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 2
Conference
2016 Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2016, pp.2051-2057 2
Conference
2016 Analysis of Bond Pull Test using Al Ultrasonic Bonding Process   오애선   대한전자공학회 종합 학술 대회 (하계) 2016, pp.1-3
Conference
2016 Fabrication of Resolution Gauge Pattern for X-ray Images   배현철   대한전자공학회 종합 학술 대회 (하계) 2016, pp.1-3
Journal
2016 Characterization of Transmission Lines with Through-silicon-vias and Bump Joints on High-resistivity Si Interposers for RF Three-dimensional Modules   Kwang-Seong Choi   Japanese Journal of Applied Physics, v.55, no.6S3, pp.1-5 2
Conference
2015 Characterization of Hybrid Underfill for Low-Temperature Process Applicable to Flexible Substrate   Jihye Son   Electronics Packaging Technology Conference (EPTC) 2015, pp.1-4 0
Conference
2015 High Performance Thermoelectric Cooler Module Using Hybrid Cu Paste and Si Substrate   Hyun-Cheol Bae   International Conference on Advanced Electromaterials (ICAE) 2015, pp.1-1
Conference
2015 Cost-Effective Thermoelectric Cooler Module Using Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and Solder   Hyun-Cheol Bae   International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.136-136
Conference
2015 Design and Fabrication of Thermoelectric Generator Based on BiTe Legs   S. E. Moon   IUMRS International Conference on Advanced Materials (IUMRS-ICAM) 2015, pp.1-1
Conference
2015 Electrically Conductive Paste with Copper for Flexible Packaging Application   Yong-Sung EOM   International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.144-144
Conference
2015 Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder   Yong-Sung EOM   European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5
Conference
2015 Cost-Effective Thermoelectric Cooler Packaging Using Hybrid Cu Paste   Hyun-Cheol Bae   European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-4
Conference
2015 Thermoelectric Cooler Module using Hybrid Cu Paste   배현철   한국전기전자재료학회 학술 대회 (하계) 2015, pp.1-1
Conference
2015 Isotropic Conductive Paste with Copper Powder for Flexible Thermoelectric Device   엄용성   한국전기전자재료학회 학술 대회 (하계) 2015, pp.1-1
Journal
2015 Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection   Hyun-Cheol Bae   한국마이크로전자 및 패키징학회지, v.22, no.2, pp.55-59
Conference
2015 Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV Liners for 3D RF Module   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2015, pp.928-933 4
Journal
2015 Interconnection Technology Based on InSn Solder for Flexible Display Applications   Kwang-Seong Choi   ETRI Journal, v.37, no.2, pp.387-394 13
Conference
2015 Maskless Screen Printing Technology using Solder Bump Maker (SBM) for Flexible Electronics   Kwang-Seong Choi   International Conference on Electronics Packaging & iMAPS All Asia Conference (ICEP & IAAC) 2015, pp.276-291
Conference
2015 미세피치를 위한 Solder-on-Pad 공정 및 높이 예측   이학선   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.1-1
Conference
2015 Hybrid Cu Paste를 적용한 열전 소자 모듈   배현철   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.18-18
Conference
2015 Development of High-Resistivity Si Interposer for 3D RF Module   최광성   한국마이크로전자 및 패키징학회 학술 대회 (춘계) 2015, pp.9-9
Journal
2015 Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste   Yong-Sung Eom   한국마이크로전자 및 패키징학회지, v.22, no.1, pp.51-54
Conference
2014 Fault Detection and Isolation of Multiple Defects in Through Silicon Via (TSV) Channel   Daniel H. Jung  International 3D Systems Integration Conference (3DIC) 2014, pp.1-5 5
Conference
2014 Non-Destructive Inspection of 3D stacked TSV Module Using X-ray Computed Tomography   배현철   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Conference
2014 Development of Fluxing Underfill for Sn/27In/54Bi Solder with Melting Temperature of 83℃   정이슬   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Conference
2014 Shear Strength Analysis of Hybrid Cu Paste for Thermoelectric Device Module   오애선   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Conference
2014 Study of Process Development for HU with a High Thixotropy   손지혜   한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1
Journal
2014 Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications   Haksun Lee   IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.10, pp.1729-1738 15
Conference
2014 Development of Low Contact Resistance Interconnection for Display Applications   Haksun Lee   Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-5 4
Conference
2014 Flip-Chip Bonding Processes with Low Volume SoP Technology   Yong-Sung EOM   Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 0
Journal
2014 Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life   Yong-Sung Eom   ETRI Journal, v.36, no.3, pp.343-351 35
Conference
2014 Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 8
Journal
2013 Fine‐Pitch Solder on Pad Process for Microbump Interconnection   Hyun-Cheol Bae   ETRI Journal, v.35, no.6, pp.1152-1155 22
Journal
2013 Recent Trends of Flip Chip Bonding Technology   최광성   전자통신동향분석, v.28, no.5, pp.100-110
Conference
2013 Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers   Kwang-Seong Choi   International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 0
Conference
2013 Novel Low-Volume Solder-on-Pad for Fine-Pitch Cu Pillar Bump   Hyun-Cheol Bae   European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-4
Conference
2013 Novel Interconnection Technology for Flex-on-Glass (FOG) Applications   Haksun Lee   European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5
Journal
2013 Optimization of Material and Process for Fine Pitch LVSoP Technology   Yong-Sung Eom   ETRI Journal, v.35, no.4, pp.625-631 21
Conference
2013 Epoxy Copper Paste as an Isotropic Conductive Adhesive   Yong-Sung EOM   International Conference on Electronics Packaging (ICEP) 2013, pp.507-510
Journal
2013 Novel Bumping Process for Solder on Pad Technology   Kwang-Seong Choi   ETRI Journal, v.35, no.2, pp.340-343 23
Conference
2013 Si-interposer Design for GPU-Memory Integration concerning the Signal Integrity   Jonghyun Cho  DesignCon 2013, pp.1-20
Conference
2012 Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process   Ho-Eun Bae   Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 2
Conference
2012 Wafer Level Packaging for MEMS Devices   배현철   한국마이크로전자 및 패키징학회 학술 대회 2012, pp.6-6
Conference
2012 Novel Solder-on-Pad (SoP) Material and Process for Low-Cost Interposers   Kwang-Seong Choi   Annual Global Interposer Technology Workshop (GIT) 2012, pp.1-2
Journal
2012 Novel Bumping and Underfill Technologies for 3D IC integration   Ki-Jun Sung  ETRI Journal, v.34, no.5, pp.706-712 30
Conference
2012 3D SiP Module Using TSV and Novel Low-Volume Solder-on-Pad(SoP) Process   Hyun-Cheol Bae   Electronic System-Integration Technology Conference (ESTC) 2012, pp.1-4 1
Conference
2012 Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 1
Journal
2012 Technical Trends of Interposers for 2.5D Integration   최광성   전자통신동향분석, v.27, no.1, pp.51-60
Conference
2011 Cost-Effective and High-Performance FBAR Duplexer Module with Wafer Level Packaging   Hyun-Cheol Bae   Asia-Pacific Microwave Conference (APMC) 2011, pp.1074-1077
Conference
2011 Cost-Effective and High-Performance FBAR Duplexer Module with Wafer Level Packaging   Hyun-Cheol Bae   Asia-Pacific Microwave Conference (APMC) 2011, pp.1074-1077
Conference
2011 Chip-to-chip Bonding용 Fluxing Underfill 개발   전수정   한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1
Conference
2011 Low-volume Solder-on-Pad Technology for 3D IC Integration   배호은   한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1
Journal
2011 Novel Bumping Material for Solder-on-Pad Technology   Kwang-Seong Choi   ETRI Journal, v.33, no.4, pp.637-640 32
Conference
2011 Bumping and Stacking Processes for 3D IC using Fluxfree Polymer   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 3
Journal
2010 3D IC Using through Silicon via Technologies   최광성   전자통신동향분석, v.25, no.5, pp.97-105
Conference
2010 Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding   Kwang-Seong Choi   International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.805-805 3
Conference
2010 Solder Bump Maker with Coining Process on TSV Chips for 3D Packages   Ki-Jun Sung  International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.185-189 3
Conference
2010 3D SiP Module using TSV and Novel Solder Bump Maker   Hyun-Cheol Bae   Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 5
Conference
2010 Optimized TSV Process using Bottom-up Electroplating without Wafer Cracks   Byeong-Ok Lim  Electronic Components and Technology Conference (ECTC) 2010, pp.1642-1646 6
Conference
2010 Compact FBAR Duplexer Module using Glass Wafer Level Packaging   배현철   한국 MEMS 학술 대회 (KMEMS) 2010, pp.253-254
Journal
2010 Novel Maskless Bumping for 3D Integration   Kwang-Seong Choi   ETRI Journal, v.32, no.2, pp.342-344 37
Conference
2009 Novel Bumping Material for Stacking Silicon Chips   Kwang Seong Choi   Electronics Packaging Technology Conference (EPTC) 2009, pp.579-583 2
Journal
2009 Development of High-Quality LTCC Solenoid Inductor using Solder Ball and Air Cavity for 3-D SiP   Hyun-Cheol Bae   한국마이크로전자 및 패키징학회지, v.46, no.4, pp.5-8
Conference
2009 High-Quality LTCC Solenoid Inductor Using Air Cavity on Silicon Wafer for 3D Integrated Circuit   Hyun Cheol Bae   International Conference and Exhibition on Device Packaging (IMAPS) 2009, pp.1-1
Journal
2008 New fabrication of a strained Si/Si1−yGey dual channel on a relaxed Si1−xGex virtual substrate using a Ge-rich layer formed by oxidation   Sang-Hoon Kim   Applied Surface Science, v.254, no.19, pp.6025-6029 1
Conference
2007 Cost Effective Parallel-branch Spiral Inductor with Enhanced Quality Factor and Resonance Frequency   Hyun-Cheol Bae   Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) 2007, pp.87-90 1
Conference
2007 A Concurrent Dual-Band VCO with Dual Resonance in Single Resonator   Ja-Yol Lee   Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) 2007, pp.135-138 5
Conference
2006 Structure Optimization of Strained Si/Si1-yGey Dual-Channel Heterostructures on Relaxed Si1-xGex (x   Sang Hoon Kim   MRS Meeting 2006 (Fall), pp.1-2
Conference
2006 SiGe BiCMOS Technology for High Speed Communications   Sang Heung Lee   Workshop on SiGe and Related Semiconductor 2006, pp.1-23
Conference
2006 Q 인자 특성을 개선한 병렬 분기형 인덕터   배현철   대한전자공학회 종합 학술 대회 (하계) 2006, pp.547-548
Journal
2006 Structure-related Characteristics of SiGe HBT and 2.4 GHz Down-Conversion Mixer   Sang Heung Lee   Journal of Semiconductor Technology and Science, v.6, no.2, pp.114-118
Conference
2006 A Single-Resonator Dual-Band VCO without Band-Selection Switch   J. Y. Lee   한국반도체 학술 대회 (KCS) 2006, pp.1-2
Conference
2006 A Wideband Fully Integrated SiGe BiCMOS Medium Power Amplifier   H. C. Bae   한국반도체 학술 대회 (KCS) 2006, pp.1-2
Conference
2006 Structure-Related Characteristics of SiGe HBT and 2.4 GHz Down-Conversion Mixer   Sang Heung Lee   한국반도체 학술 대회 (KCS) 2006, pp.1-2
Journal
2005 Strain Relaxed SiGe Buffer Prepared by Means of Thermally Driven Relaxation and CMP   Sang Hoon Kim   Electrochemical and Solid-State Letters, v.8, no.11, pp.G304-G306 5
Conference
2005 A Novel Method to Fabricate Recessed SiGe Source/Drain using a selective Si and SiGe Epitaxial Growth without Etching Process   Sang Hoon Kim   MRS Meeting 2005 (Fall), pp.1-2
Conference
2005 Characteristics of SiGe device fabricated by SiGe BiCMOS technology and its application to a 5.8 GHz MMIC down-conversion mixer   Sang-Heung Lee   Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) 2005, pp.232-235
Journal
2005 Monolithic SiGe Up-/Down-Conversion Mixers with Active Baluns   Sang-Heung Lee   ETRI Journal, v.27, no.5, pp.569-578 3
Journal
2005 A 5.8 GHz SiGe Up-Conversion Mixer with On-Chip Active Baluns for DSRC Transmitter   이상흥   한국통신학회논문지, v.30, no.4A, pp.350-357
Conference
2004 A Wideband Monolithic Up-Conversion Mixer with On-Chip Active Baluns   Sang-Heung Lee   한국통신학회 종합 학술 발표회 (하계) 2004, pp.323-323
Conference
2003 A 5.8 GHz up-conversion mixer for DSRC transmitter   Sang-Heung Lee   Radio and Wireless Conference (RAWCON) 2003, pp.369-372 1
Journal
2003 1/f noise in Si/sub 0.8/Ge/sub 0.2/ pMOSFETs under Fowler-Nordheim stress   Young-Joo Song   IEEE Transactions on Electron Devices, v.50, no.4, pp.1152-1156 12
Conference
2002 A SiGe HBT differential MMIC VCO for PCS Application   Ja-Yol Lee   한국통신학회 종합 학술 발표회 (하계) 2002, pp.267-270
Journal
2002 Design and Fabrication of MMIC Amplifier for BWLL   배현철   한국전자파학회논문지, v.13, no.4, pp.323-330