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Conference
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2023 |
A Study of the Laser Soldering Process for High-frequency PCB Substrate
권상진
Photonics Conference 2023, pp.1-2 |
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Conference
|
2023 |
TEC power consumption analysis of the 2x4 lambda LWDM EML TOSA module
권원배
Photonics Conference 2023, pp.1-2 |
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Conference
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2023 |
100 Gbps Fully-Integrated Silicon Photonics Transmitter Technology
유상화
광전자 및 광통신 학술 회의 (COOC) 2023, pp.1-1 |
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Conference
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2023 |
Implementation of silicon photonics-in-package (SiP) based 100Gbps PAM-4 optical transceiver and its key technologies
Jyung Chan Lee
광전자 및 광통신 학술 회의 (COOC) 2023, pp.1-2 |
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Conference
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2023 |
Implementation of silicon photonics-in-package (SiP) based 100Gbps PAM-4 chip-on-board (COB) and optical transceiver
Jyung Chan Lee
한국광학회 학술 발표회 (동계) 2023, pp.1-1 |
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Journal
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2022 |
53 GBd PAM-4 fully-integrated silicon photonics transmitter with a hybrid flip-chip bonded laser
Sanghwa Yoo
Optics Express, v.30, no.23, pp.41980-41998 |
5 |
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Conference
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2022 |
TEC power consumption of the 8 channel EML TOSA module
권원배
Photonics Conference 2022, pp.1-2 |
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Conference
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2022 |
Non-contact High Speed POB Solder Joint Process Using Laser Heating
권상진
Photonics Conference 2022, pp.1-2 |
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Conference
|
2022 |
Chip-On-Board Implementation of 106Gb/s PAM4 Silicon Photonics Transmit and Receive and its Real-Time Operation
Jyung Chan Lee
Optics and Photonics Congress 2022, pp.1-1 |
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Conference
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2022 |
Implementation of Low Power Consumption Optical Transmitter Module Platform
강은규
광전자 및 광통신 학술 회의 (COOC) 2022, pp.1-1 |
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Conference
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2022 |
100 Gbps Silicon Photonics Transmitter Technology
유상화
광전자 및 광통신 학술 회의 (COOC) 2022, pp.1-1 |
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Conference
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2021 |
Thermal Characteristic of the 800Gbps Non-hermetic Package
권원배
Photonics Conference 2021, pp.1-2 |
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