ETRI-Knowledge Sharing Plaform

Solder Bump Micro Light-Emitting Diodes(micro-LEDs) Fine Pitch Bonding Process Conductive Paste Laser-Assisted Bonding Room-Temperature Display Panel Solder Paste Process Window Post-Curing Bonding Technology Anisotropic Conductive Films(ACFs) Display Module Glass Substrate Chip-On-Wafer Non-Conductive Film Micro-Led Display High-Resolution Pot Life Low-Carbon Full-Color Highly Reliable Heat Dissipation Shear Strength Interconnection Materials Negative Differential Resistance(NDR) Nitride-Based Thermocompression Bonding Temperature Uniformity Temperature And Pressure Reliability Of Components Resin Matrix Bonding Accuracy Epoxy-Based Carbon Epoxy Climate Change Effective Production Flat Heat Pipe Hybrid Bonding Integration Technology International Competitiveness Laser Process Flux Residues Power Consumption Process Time Wall Structure Need For Next-Generation Operational Voltage Test Study Boron Nitride(BN) Current-Voltage Creative Technology Curing Agent Display Resolution High Power High-Pressure High-Quality Initialization Vector(IV) Led Packaging Melting Temperature(Tm) Constant Temperature And Humidity Surface Mount Technology Market Demand Plasma Treatment Production Space Uniform Temperature Adverse Effects Bonding Temperature Thermal Compression Bonding Reflow Process Bonding Area And Systems Epoxy-Siloxane Film Materials Flip-Chip Bonding Signal-To-Noise Short Time Semiconductor Device Vanillic Acid Wafer Level Wafer-On-Wafer(WoW) Nonreturn-To-Zero(NRZ) Two Layers Reduction Reaction High Alignment Accuracy Bonding Methods Enhanced Performance Enabling Technologies High-Temperature Aging Laser Irradiation Area Laser Power 1310 Nm 50 GB Polymer Matrix Packaging Solution Wire-Bonded Chemical Stability Electrical Resistance Green Chemistry High Thermal Conductivity Yield Management Led Devices Polymer Chain Oxide Layer Thermally Conductive Reducing Agent High Yield Avalanche Photodetector Critical Time Metal-Coated Multiple Hot Spots Passive Device Nanocomposite Adhesive Thermosetting Materials By-Products Curing Process Display Technology Epoxy-Functionalized Short Process Organic-Inorganic Hybrid Materials Optical Alignment Tensile Strength Reliability Testing Avalanche Breakdown Voltage Assembly Process Bit Error Rate(And BER) Blue Leds Cycle Time Ge-On-Si Low-Cost Led Array Low Viscosity Module Performance 40 Gb/S Sapphire Substrates Screen Printing Surface Oxide Solvent-Free