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Won-Bae Kwon
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Optical Packaging Research Section
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Type Year Title Cited Download
Journal
2024 Compact lithium niobate plasmonic modulator   Myunghwan Kim   Optics Letters, v.49, no.4, pp.939-942 0
Conference
2023 A Study of the Laser Soldering Process for High-frequency PCB Substrate   권상진   Photonics Conference 2023, pp.1-2
Conference
2023 TEC power consumption analysis of the 2x4 lambda LWDM EML TOSA module   권원배   Photonics Conference 2023, pp.1-2
Conference
2023 Fabrication and analysis of TGV(Through glass via) for Co-Packaged Optics   강은규   Photonics Conference 2023, pp.1-2
Conference
2022 Four Wave Mixing Effect on O-bnad LWDM4 Wavelength of PAM4-106Gbps Modulated Signal   정수용   Photonics Conference 2022, pp.1-2
Conference
2022 Non-contact High Speed POB Solder Joint Process Using Laser Heating   권상진   Photonics Conference 2022, pp.1-2
Conference
2022 TEC power consumption of the 8 channel EML TOSA module   권원배   Photonics Conference 2022, pp.1-2
Conference
2021 Thermal Characteristic of the 800Gbps Non-hermetic Package   권원배   Photonics Conference 2021, pp.1-2
Conference
2021 Transmitter Optical Engine with Glass Interposer   김대선   Photonics Conference 2021, pp.1-2
Conference
2021 A Study on the Method of Measuring Internal Humidity in Non-hermetic Packages   정수용   Photonics Conference 2021, pp.1-2
Conference
2021 Cooling Performance of QSFP-DD800 Optical Transceiver for Datacenter Network   권상진   Photonics Conference 2021, pp.1-2
Conference
2020 Study on multimode fiber based silicon photonics transceiver structure   염현웅   광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2
Conference
2020 90 degree wire bonding for 100 Gbps ROSA platform   강은규   광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2
Conference
2020 Thermal characteristics of TO package and flat package for cooled TOSA   권원배   광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2
Journal
2019 Frequency Response Estimation of 1.3 μm Waveguide Integrated Vertical PIN Type Ge-on-Si Photodetector Based on the Analysis of Fringing Field in Intrinsic Region   Dongjun Seo  Current Optics and Photonics, v.3, no.6, pp.510-515 4