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Jiho Joo
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Low-Carbon Integration Technology Creative Research Section
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Type Year Title Cited Download
Journal
2024 Microlens Encapsulation of Thixotropic Siloxane/Silica Nanocomposites for Highly Efficient and Reliable Micro-Light-Emitting Diodes   Byung Jo Um, Hyungshin Kweon, Jiho Joo   ADVANCED OPTICAL MATERIALS, v.권호미정, pp.1-9 0
Conference
2024 Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)   Ki-Seok Jang   Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4
Conference
2024 Micro-LED display fabrication method using simultaneous transfer and bonding (SITRAB) technology   신정호   대한전자공학회 학술 대회 (하계) 2024, pp.3346-3347
Conference
2024 Never drying solder paste at room temperature for semiconductor packaging process   엄용성   대한전자공학회 학술 대회 (하계) 2024, pp.3344-3345
Conference
2024 Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology   Jungho Shin   Society for Information Display (SID) International Symposium 2024, pp.1278-1281
Conference
2024 Development of a Full-Color MicroLED Display Utilizing Novel Simultaneous Transfer and Bonding (SITRAB) Process and SITRAB Film Technology   Jiho Joo   Society for Information Display (SID) International Symposium 2024, pp.1309-1312
Journal
2024 Process window of simultaneous transfer and bonding materials using laser-assisted bonding for mini- and microLED display panel packaging   Yong-Sung Eom   ETRI Journal, v.46, no.2, pp.347-359 5
Conference
2024 Transfer, bonding, repair of LEDs via simultaneous transfer and bonding (SITRAB) technology   신정호   한국마이크로전자 및 패키징학회 학술 대회 2024, pp.1-1
Conference
2024 Process window of Laser Non-Conductive Paste for Flip-chip Laser-Assisted Bonding   엄용성   한국마이크로전자 및 패키징학회 학술 대회 2024, pp.43-43
Conference
2024 A 94 GHz SiGe BiCMOS receiver packaged with FOWLP technology   이상흥   한국전자파학회 종합 학술 대회 (동계) 2024, pp.184-184
Conference
2023 94 GHz SiGe BiCMOS PA FOWLP의 고온 특성 평가 및 분석   이상흥   한국전자파학회 종합 학술 대회 (추계) 2023, pp.106-106
Conference
2023 94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems   Jiho Joo   International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23
Conference
2023 Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology   Yong-Sung Eom   European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 0
Conference
2023 Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process   Ki-Seok Jang   European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 0
Conference
2023 Highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology   Jiho Joo   International Meeting on Information Display (IMID) 2023, pp.1-1
Conference
2023 Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 3
Conference
2023 Development of Bonding Technology of HBM2-Level Stacked Chip with Reliability using Developed Electroplating Materials   엄용성   한국표면공학회 학술 대회 (춘계) 2023, pp.70-70
Conference
2023 Development of a highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology   Jiho Joo   Society for Information Display (SID) International Symposium 2023, pp.433-436 2
Conference
2022 Isosorbide-Based Organic-Inorganic Hybrid Materials for Green Chemistry   Gwang-Mun Choi   Materials Research Society (MRS) Meeting 2022 (Fall), pp.1-2
Conference
2022 Micro/Mini LED Array Transferred onto a Flexible Substrate Using Simultaneous Transfer and Bonding (SITRAB) Process and Anisotropic Solder Film (ASF)   Jiho Joo   International Meeting on Information Display (IMID) 2022, pp.1-19
Conference
2022 Development of Flexible full-color Mini-LED display using simultaneous transfer and bonding (SITRAB) technology   주지호   대한전자공학회 학술 대회 (하계) 2022, pp.1-2
Conference
2022 Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2022, pp.619-624 1
Conference
2022 Interconnection Reliability of Mini LEDs for Display Applications   In-Seok Kye   Electronic Components and Technology Conference (ECTC) 2022, pp.1184-20 0
Conference
2022 Development of Flexible Full-Color Mini-LED Display Using Simultaneous Transfer and Bonding (SITRAB) Technology   Jiho Joo   Society for Information Display (SID) International Symposium 2022, pp.1005-1008 12
Conference
2022 Interconnection Reliability Analysis of Mini-LEDs for Display Applications   In-Seok Kye   대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-19
Conference
2022 Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 4
Conference
2022 Evaluation of Solder Wetting and Screen-Printing with Dry-Free Solder Paste   장기석   대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-13
Journal
2022 MicroLED Transfer, Bonding, and Bad Pixel Repair Technology   최광성   전자통신동향분석, v.37, no.2, pp.53-61
Conference
2022 Dry-Free Solder Paste with No Viscosity change at R.T. & No Adhesion change after Screen-Printing Process   장기석   한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-1
Conference
2022 Development of Mini-LED display using simultaneous transfer and bonding (SITRAB) technology   주지호   한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2
Conference
2022 Comparison of mini-LED bonding using ACF(Anisotropic conductive film) and ASF(Anisotropic solder film)   이찬미   한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2
Journal
2021 Three-dimensional Wavelength-division Multiplexing Interconnects based on a Low-loss SixNy Arrayed Waveguide Grating   Jaegyu Park   Optics Express, v.29, no.22, pp.35261-35270 5
Conference
2021 Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 11
Conference
2021 W-band SiGe BiCMOS Mixer MMIC   이상흥   대한전자공학회 학술 대회 (하계) 2021, pp.2275-2277
Conference
2021 Development of Simultaneous Transferring and Bonding (SITRAB) Process for μLED Arrays Using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 5
Conference
2021 Simultaneous Transfer and Bonding (SITRAB) Process for Mini-LED Display   Kwang-Seong Choi   Society for Information Display (SID) International Symposium 2021, pp.841-844 4
Journal
2021 Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining   Gwang-Mun Choi   Polymers, v.13, no.6, pp.1-14 9
Conference
2020 Study on Epoxy-Solder Hybrid Underfill Material for Fine-Pitch Bonding Application   최광문   한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-1
Conference
2020 Low fume and No-cleaning Solder Wire Technology   장기석   한국마이크로전자 및 패키징학회 2020, pp.1-1
Conference
2020 Development of LAB-based low thermal deformation bonding technology for PCT substrates that are vulnerable to thermal processes   이찬미   한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-14
Conference
2020 Low-loss, Low-crosstalk Silicon Nitirde Array Waveguide Grating using Multimode Waveguide at 850nm   Jaegyu Park   IEEE Photonics Conference (IPC) 2020, pp.1-2 0
Conference
2020 Development of film-based ultra-compact GaAs photovoltaic module using Laser-Assisted Bonding   Jiho Joo   European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2020, pp.1-1
Journal
2020 Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging   엄용성   전자통신동향분석, v.35, no.4, pp.1-10
Conference
2020 0.13 um SiGe BiCMOS를 이용한 94 GHz 믹서 MMIC 설계 및 제작   이상흥   한국전자파학회 종합 학술 대회 (하계) 2020, pp.795-795
Conference
2020 Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 10
Conference
2020 Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2020, pp.1031-1036 9
Conference
2019 Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration   Kwang-Seong Choi   International 3D Systems Integration Conference (3DIC) 2019, pp.1-3 2
Conference
2019 Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate   Yong-Sung Eom   European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 0
Journal
2019 Low-Crosstalk Silicon Nitride Arrayed Waveguide Grating for the 800-nm Band   Jaegyu Park   IEEE Photonics Technology Letters, v.31, no.14, pp.1183-1186 13
Conference
2019 Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 18