Journal
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2024 |
Microlens Encapsulation of Thixotropic Siloxane/Silica Nanocomposites for Highly Efficient and Reliable Micro-Light-Emitting Diodes
Byung Jo Um, Hyungshin Kweon,
Jiho Joo
ADVANCED OPTICAL MATERIALS, v.권호미정, pp.1-9 |
0 |
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Conference
|
2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Ki-Seok Jang
Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
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Conference
|
2024 |
Micro-LED display fabrication method using simultaneous transfer and bonding (SITRAB) technology
신정호
대한전자공학회 학술 대회 (하계) 2024, pp.3346-3347 |
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Conference
|
2024 |
Never drying solder paste at room temperature for semiconductor packaging process
엄용성
대한전자공학회 학술 대회 (하계) 2024, pp.3344-3345 |
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Conference
|
2024 |
Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology
Jungho Shin
Society for Information Display (SID) International Symposium 2024, pp.1278-1281 |
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Conference
|
2024 |
Development of a Full-Color MicroLED Display Utilizing Novel Simultaneous Transfer and Bonding (SITRAB) Process and SITRAB Film Technology
Jiho Joo
Society for Information Display (SID) International Symposium 2024, pp.1309-1312 |
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Journal
|
2024 |
Process window of simultaneous transfer and bonding materials using laser-assisted bonding for mini- and microLED display panel packaging
Yong-Sung Eom
ETRI Journal, v.46, no.2, pp.347-359 |
5 |
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Conference
|
2024 |
Transfer, bonding, repair of LEDs via simultaneous transfer and bonding (SITRAB) technology
신정호
한국마이크로전자 및 패키징학회 학술 대회 2024, pp.1-1 |
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Conference
|
2024 |
Process window of Laser Non-Conductive Paste for Flip-chip Laser-Assisted Bonding
엄용성
한국마이크로전자 및 패키징학회 학술 대회 2024, pp.43-43 |
|
|
Conference
|
2024 |
A 94 GHz SiGe BiCMOS receiver packaged with FOWLP technology
이상흥
한국전자파학회 종합 학술 대회 (동계) 2024, pp.184-184 |
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Conference
|
2023 |
94 GHz SiGe BiCMOS PA FOWLP의 고온 특성 평가 및 분석
이상흥
한국전자파학회 종합 학술 대회 (추계) 2023, pp.106-106 |
|
|
Conference
|
2023 |
94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems
Jiho Joo
International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23 |
|
|
Conference
|
2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Yong-Sung Eom
European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
|
Conference
|
2023 |
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Ki-Seok Jang
European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
|
Conference
|
2023 |
Highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology
Jiho Joo
International Meeting on Information Display (IMID) 2023, pp.1-1 |
|
|
Conference
|
2023 |
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 |
3 |
|
Conference
|
2023 |
Development of Bonding Technology of HBM2-Level Stacked Chip with Reliability using Developed Electroplating Materials
엄용성
한국표면공학회 학술 대회 (춘계) 2023, pp.70-70 |
|
|
Conference
|
2023 |
Development of a highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology
Jiho Joo
Society for Information Display (SID) International Symposium 2023, pp.433-436 |
2 |
|
Conference
|
2022 |
Isosorbide-Based Organic-Inorganic Hybrid Materials for Green Chemistry
Gwang-Mun Choi
Materials Research Society (MRS) Meeting 2022 (Fall), pp.1-2 |
|
|
Conference
|
2022 |
Micro/Mini LED Array Transferred onto a Flexible Substrate Using Simultaneous Transfer and Bonding (SITRAB) Process and Anisotropic Solder Film (ASF)
Jiho Joo
International Meeting on Information Display (IMID) 2022, pp.1-19 |
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Conference
|
2022 |
Development of Flexible full-color Mini-LED display using simultaneous transfer and bonding (SITRAB) technology
주지호
대한전자공학회 학술 대회 (하계) 2022, pp.1-2 |
|
|
Conference
|
2022 |
Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)
Jiho Joo
Electronic Components and Technology Conference (ECTC) 2022, pp.619-624 |
1 |
|
Conference
|
2022 |
Interconnection Reliability of Mini LEDs for Display Applications
In-Seok Kye
Electronic Components and Technology Conference (ECTC) 2022, pp.1184-20 |
0 |
|
Conference
|
2022 |
Development of Flexible Full-Color Mini-LED Display Using Simultaneous Transfer and Bonding (SITRAB) Technology
Jiho Joo
Society for Information Display (SID) International Symposium 2022, pp.1005-1008 |
12 |
|
Conference
|
2022 |
Interconnection Reliability Analysis of Mini-LEDs for Display Applications
In-Seok Kye
대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-19 |
|
|
Conference
|
2022 |
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 |
4 |
|
Conference
|
2022 |
Evaluation of Solder Wetting and Screen-Printing with Dry-Free Solder Paste
장기석
대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-13 |
|
|
Journal
|
2022 |
MicroLED Transfer, Bonding, and Bad Pixel Repair Technology
최광성
전자통신동향분석, v.37, no.2, pp.53-61 |
|
|
Conference
|
2022 |
Dry-Free Solder Paste with No Viscosity change at R.T. & No Adhesion change after Screen-Printing Process
장기석
한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-1 |
|
|
Conference
|
2022 |
Development of Mini-LED display using simultaneous transfer and bonding (SITRAB) technology
주지호
한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2 |
|
|
Conference
|
2022 |
Comparison of mini-LED bonding using ACF(Anisotropic conductive film) and ASF(Anisotropic solder film)
이찬미
한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2 |
|
|
Journal
|
2021 |
Three-dimensional Wavelength-division Multiplexing Interconnects based on a Low-loss SixNy Arrayed Waveguide Grating
Jaegyu Park
Optics Express, v.29, no.22, pp.35261-35270 |
5 |
|
Conference
|
2021 |
Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 |
11 |
|
Conference
|
2021 |
W-band SiGe BiCMOS Mixer MMIC
이상흥
대한전자공학회 학술 대회 (하계) 2021, pp.2275-2277 |
|
|
Conference
|
2021 |
Development of Simultaneous Transferring and Bonding (SITRAB) Process for μLED Arrays Using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
Jiho Joo
Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 |
5 |
|
Conference
|
2021 |
Simultaneous Transfer and Bonding (SITRAB) Process for Mini-LED Display
Kwang-Seong Choi
Society for Information Display (SID) International Symposium 2021, pp.841-844 |
4 |
|
Journal
|
2021 |
Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
Gwang-Mun Choi
Polymers, v.13, no.6, pp.1-14 |
9 |
|
Conference
|
2020 |
Study on Epoxy-Solder Hybrid Underfill Material for Fine-Pitch Bonding Application
최광문
한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-1 |
|
|
Conference
|
2020 |
Low fume and No-cleaning Solder Wire Technology
장기석
한국마이크로전자 및 패키징학회 2020, pp.1-1 |
|
|
Conference
|
2020 |
Development of LAB-based low thermal deformation bonding technology for PCT substrates that are vulnerable to thermal processes
이찬미
한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-14 |
|
|
Conference
|
2020 |
Low-loss, Low-crosstalk Silicon Nitirde Array Waveguide Grating using Multimode Waveguide at 850nm
Jaegyu Park
IEEE Photonics Conference (IPC) 2020, pp.1-2 |
0 |
|
Conference
|
2020 |
Development of film-based ultra-compact GaAs photovoltaic module using Laser-Assisted Bonding
Jiho Joo
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2020, pp.1-1 |
|
|
Journal
|
2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
엄용성
전자통신동향분석, v.35, no.4, pp.1-10 |
|
|
Conference
|
2020 |
0.13 um SiGe BiCMOS를 이용한 94 GHz 믹서 MMIC 설계 및 제작
이상흥
한국전자파학회 종합 학술 대회 (하계) 2020, pp.795-795 |
|
|
Conference
|
2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo
Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
10 |
|
Conference
|
2020 |
Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2020, pp.1031-1036 |
9 |
|
Conference
|
2019 |
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
Kwang-Seong Choi
International 3D Systems Integration Conference (3DIC) 2019, pp.1-3 |
2 |
|
Conference
|
2019 |
Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
Yong-Sung Eom
European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 |
0 |
|
Journal
|
2019 |
Low-Crosstalk Silicon Nitride Arrayed Waveguide Grating for the 800-nm Band
Jaegyu Park
IEEE Photonics Technology Letters, v.31, no.14, pp.1183-1186 |
13 |
|
Conference
|
2019 |
Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 |
18 |
|