Conference
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2024 |
Design of an 800 Gbps Silicon Photonics based Optical Engine
유상화
광전자 및 광통신 학술 회의 (COOC) 2024, pp.1-1 |
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Journal
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2024 |
Compact lithium niobate plasmonic modulator
Myunghwan Kim
Optics Letters, v.49, no.4, pp.939-942 |
0 |
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Conference
|
2023 |
Wavelength change of 2x4 LWDM EML TOSA depending on TEC cooling condition
정수용
Photonics Conference 2023, pp.1-2 |
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Conference
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2023 |
TEC power consumption analysis of the 2x4 lambda LWDM EML TOSA module
권원배
Photonics Conference 2023, pp.1-2 |
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Conference
|
2023 |
A Study of the Laser Soldering Process for High-frequency PCB Substrate
권상진
Photonics Conference 2023, pp.1-2 |
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Conference
|
2023 |
Fabrication and analysis of TGV(Through glass via) for Co-Packaged Optics
강은규
Photonics Conference 2023, pp.1-2 |
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Conference
|
2023 |
100 Gbps Fully-Integrated Silicon Photonics Transmitter Technology
유상화
광전자 및 광통신 학술 회의 (COOC) 2023, pp.1-1 |
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Conference
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2023 |
Implementation of silicon photonics-in-package (SiP) based 100Gbps PAM-4 optical transceiver and its key technologies
Jyung Chan Lee
광전자 및 광통신 학술 회의 (COOC) 2023, pp.1-2 |
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Conference
|
2023 |
Implementation of silicon photonics-in-package (SiP) based 100Gbps PAM-4 chip-on-board (COB) and optical transceiver
Jyung Chan Lee
한국광학회 학술 발표회 (동계) 2023, pp.1-1 |
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Conference
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2022 |
Four Wave Mixing Effect on O-bnad LWDM4 Wavelength of PAM4-106Gbps Modulated Signal
정수용
Photonics Conference 2022, pp.1-2 |
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Journal
|
2022 |
53 GBd PAM-4 fully-integrated silicon photonics transmitter with a hybrid flip-chip bonded laser
Sanghwa Yoo
Optics Express, v.30, no.23, pp.41980-41998 |
5 |
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Conference
|
2022 |
Non-contact High Speed POB Solder Joint Process Using Laser Heating
권상진
Photonics Conference 2022, pp.1-2 |
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Conference
|
2022 |
TEC power consumption of the 8 channel EML TOSA module
권원배
Photonics Conference 2022, pp.1-2 |
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Conference
|
2022 |
Chip-On-Board Implementation of 106Gb/s PAM4 Silicon Photonics Transmit and Receive and its Real-Time Operation
Jyung Chan Lee
Optics and Photonics Congress 2022, pp.1-1 |
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Conference
|
2022 |
Implementation of Low Power Consumption Optical Transmitter Module Platform
강은규
광전자 및 광통신 학술 회의 (COOC) 2022, pp.1-1 |
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Conference
|
2022 |
100 Gbps Silicon Photonics Transmitter Technology
유상화
광전자 및 광통신 학술 회의 (COOC) 2022, pp.1-1 |
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Conference
|
2021 |
Transmitter Optical Engine with Glass Interposer
김대선
Photonics Conference 2021, pp.1-2 |
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Conference
|
2021 |
A Study on the Method of Measuring Internal Humidity in Non-hermetic Packages
정수용
Photonics Conference 2021, pp.1-2 |
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Conference
|
2021 |
Cooling Performance of QSFP-DD800 Optical Transceiver for Datacenter Network
권상진
Photonics Conference 2021, pp.1-2 |
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Conference
|
2021 |
Thermal Characteristic of the 800Gbps Non-hermetic Package
권원배
Photonics Conference 2021, pp.1-2 |
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Conference
|
2020 |
Electrode Interconnection of Glass VIA and Ceramic Optical-bench by using localized Laser Heating for High-speed Optical Communication Module
권상진
Photonics Conference 2020, pp.1-2 |
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Conference
|
2020 |
60GHz Glass interposer for optoelectronics packaging
김대선
광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2 |
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Conference
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2020 |
Thermal characteristics of TO package and flat package for cooled TOSA
권원배
광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2 |
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Conference
|
2020 |
90 degree wire bonding for 100 Gbps ROSA platform
강은규
광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2 |
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Conference
|
2020 |
Study on multimode fiber based silicon photonics transceiver structure
염현웅
광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2 |
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Conference
|
2018 |
A Study on the 100Gbps CWDM4 TOSA Platform
정수용
한국통신학회 종합 학술 발표회 (하계) 2018, pp.1476-1477 |
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Conference
|
2017 |
A Study on the Implementation of Automated System for Optical Packaging Manufacturing Process
유홍연
한국통신학회 종합 학술 발표회 (동계) 2017, pp.1105-1106 |
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Journal
|
2016 |
Coupled-cavity-based Slow Light Metamaterials with Antireflection Structures
Sun-Goo Lee
Applied Physics Letters, v.109, no.22, pp.1-4 |
1 |
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Journal
|
2016 |
Self-collimation-based photonic crystal Mach–Zehnder demultiplexer
Sun-Goo Lee
Journal of Optics, v.18, no.9, pp.1-7 |
7 |
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Conference
|
2016 |
A Study on Bidirectional Optical Interconnection for I2C Interface
정수용
한국통신학회 종합 학술 발표회 (하계) 2016, pp.976-977 |
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Conference
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2016 |
워터쉐드 분할 영역을 이용한 광 커넥터 오염 물질 검출 방법
유홍연
영상 처리 및 이해에 관한 워크샵 (IPIU) 2016, pp.1-2 |
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Journal
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2015 |
Self-collimation-based photonic crystal Mach–Zehnder add-drop filters
Sun-Goo Lee
Journal of Physics D : Applied Physics, v.49, no.5, pp.1-7 |
5 |
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Journal
|
2015 |
Market and Technology Trends in 100Gb/s Optical Transceiver
이종진
전자통신동향분석, v.30, no.1, pp.65-76 |
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Journal
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2013 |
Physical Media Dependent Prototype for 10-Gigabit-Capable PON OLT
Jongdeog Kim
ETRI Journal, v.36, no.2, pp.245-252 |
18 |
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Journal
|
2012 |
Single package directly modulated laser bidirectional optical subassembly using a modified mini-dual-in-line package for 10 Gbps passive optical networks
Jong Jin Lee
Optical Engineering, v.51, no.12, pp.1-3 |
1 |
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Journal
|
2011 |
10-Gbps Electroabsorptive Modulated Laser Bidirectional Optical Subassembly using Novel Two-window Flat Package for Passive Optical Network
Jong Jin Lee
Optical Engineering, v.50, no.12, pp.1-3 |
2 |
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Journal
|
2011 |
Novel Color Combiner Composed of Red, Green, and Blue Laser Diodes and a Thermally Expanded Core Fiber Waveguide
In Hee Shin
Optical Engineering, v.50, no.9, pp.1-4 |
3 |
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Journal
|
2011 |
Novel Bumping Material for Solder-on-Pad Technology
Kwang-Seong Choi
ETRI Journal, v.33, no.4, pp.637-640 |
31 |
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Journal
|
2010 |
Low-Cost Coaxial-Type Single TO-can Bidirectional Optical Subassembly
K.-S. Lim
Electronics Letters, v.46, no.23, pp.1556-1557 |
10 |
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Journal
|
2010 |
Compact Bidirectional Optical Subassembly Vertically Stacked with 1.25-Gbps Transmitter and 10-Gbps Receiver for Passive Optical Networks
Jong Jin Lee
Optical Engineering, v.49, no.11, pp.1-3 |
2 |
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Conference
|
2010 |
Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding
Kwang-Seong Choi
International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.805-805 |
3 |
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Conference
|
2009 |
Bi-Directional Optical Subassembly based on Optical Communication SOP Technology
강현서
Photonics Conference 2009, pp.1-2 |
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Conference
|
2009 |
Thermal Performance of BOSA Module using LTCC
이종진
Photonics Conference 2009, pp.1-2 |
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Journal
|
2009 |
Novel Bidirectional Optical Subassembly with Embedded Filter, 45-Degree Angle Polished Fiber Cladding and Etched Fiber Core
Sei Hyoung Lee
Optical Engineering, v.48, no.10, pp.100502-1-100502-3 |
0 |
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Journal
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2009 |
Optical Communications Convergence SOP Technology
임권섭
전자통신동향분석, v.24, no.1, pp.1-11 |
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Journal
|
2008 |
Simultaneous Transmission of 2.5-Gb/s Baseband and 5.8-GHz-band Radio Frequency Signals on a Single Wavelength using Optical Diplexer and Mixed-signal Multiplexer
Kwon-Seob Lim
Optical Engineering, v.47, no.12, pp.1-3 |
0 |
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Conference
|
2008 |
High Efficiency Core Mode Out-coupling Method and the Fiber In-line Optical Transceiver Fabrication using the Same
이세형
한국광학회 학술 발표회 (하계) 2008, pp.321-322 |
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Conference
|
2008 |
Compact and Effective Method of Optical Signal Redirection using Core-to-Cladding Mode Coupling
Seihyoung Lee
광전자 및 광통신 학술 회의 (COOC) 2008, pp.118-119 |
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Conference
|
2008 |
Power consumption of silicon based micro TEC
이종진
광전자 및 광통신 학술 회의 (COOC) 2008, pp.399-400 |
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Conference
|
2007 |
Low Cost and High Performance Fibre In-line Bi-directional Optical Subassembly for Fibre-to-the-Home
Hyun Seo Kang
European Conference on Optical Communication (ECOC) 2007, pp.1-2 |
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Journal
|
2007 |
Passive Alignment of Photodiode by using Visible Laser and Flip Chip Bonding
유정희
한국마이크로전자 및 패키징학회지, v.14, no.3, pp.7-13 |
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Journal
|
2007 |
A Novel Low-Cost Fiber In-Line-Type Bidirectional Optical Subassembly
Kwon-Seob Lim
IEEE Photonics Technology Letters, v.19, no.16, pp.1233-1235 |
14 |
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Conference
|
2007 |
Excessive Power Penalty due to Strong External Reflection on an Isolator Free DFB Laser Diode Transmitter
Jong Jin Lee
Conference on Lasers and Electro-Optics/Pacific Rim (CLEO/PR) 2007, pp.1-2 |
0 |
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Conference
|
2007 |
Power penalty due to external reflection on an isolator free DFB transmitter
이종진
광전자 및 광통신 학술 회의 (COOC) 2007, pp.118-119 |
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Conference
|
2007 |
Flip chip bonding methode using visible laser in Photodiode packaging
유정희
광전자 및 광통신 학술 회의 (COOC) 2007, pp.126-127 |
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Journal
|
2006 |
Experimental and Theoretical Characterization of Optical Signal Out-Coupling through V-Grooved Optical Fiber Cladding
Sei Hyoung Lee
Optical Engineering, v.45, no.12, pp.1-3 |
4 |
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Conference
|
2006 |
Bi-Directional Optical Transceiver Sub Assembly based on Optical Path Conversion Technique
강현서
Photonics Conference 2006, pp.1-2 |
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Conference
|
2006 |
Fiber Pigtailing on Silicon V-Groove using Low Cost Reliable Galss Solder
이종진
Photonics Conference 2006, pp.1-2 |
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Conference
|
2006 |
The Relative Intensity Noise due to Strong External Reflection Into the Isolator Free DFB Laser Diode Transmitter
Jong Jin Lee
Passive Components and Fiber-based Devices III (APOC) 2006 (SPIE 6351), v.6351, pp.1-6 |
0 |
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Conference
|
2004 |
The mechanical reliability of optical fiber assembly using glass solder
이종진
Photonics Conference 2004, pp.505-506 |
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Conference
|
2002 |
Low thermal shift and Low stress Ferrule design for butt coupling
이종진
Photonics Conference 2002, pp.637-638 |
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