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Jong Jin Lee
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Optical Packaging Research Section
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Type Year Title Cited Download
Conference
2024 Evaluation of Solder-Join Repair on Glass Interposers for CPO Optical Module Maintenance Solutions   권상진   Photonics Conference 2024, pp.1-2
Conference
2024 Study on EAM current characteristics corresponding to the optical power of the 2x4 lambda LWDM EMLs   권원배   Photonics Conference 2024, pp.1-2
Conference
2024 Design of an 800 Gbps Silicon Photonics based Optical Engine   유상화   광전자 및 광통신 학술 회의 (COOC) 2024, pp.1-1
Journal
2024 Compact lithium niobate plasmonic modulator   Myunghwan Kim   Optics Letters, v.49, no.4, pp.939-942 0
Conference
2023 Wavelength change of 2x4 LWDM EML TOSA depending on TEC cooling condition   정수용   Photonics Conference 2023, pp.1-2
Conference
2023 TEC power consumption analysis of the 2x4 lambda LWDM EML TOSA module   권원배   Photonics Conference 2023, pp.1-2
Conference
2023 A Study of the Laser Soldering Process for High-frequency PCB Substrate   권상진   Photonics Conference 2023, pp.1-2
Conference
2023 Fabrication and analysis of TGV(Through glass via) for Co-Packaged Optics   강은규   Photonics Conference 2023, pp.1-2
Conference
2023 100 Gbps Fully-Integrated Silicon Photonics Transmitter Technology   유상화   광전자 및 광통신 학술 회의 (COOC) 2023, pp.1-1
Conference
2023 Implementation of silicon photonics-in-package (SiP) based 100Gbps PAM-4 optical transceiver and its key technologies   Jyung Chan Lee   광전자 및 광통신 학술 회의 (COOC) 2023, pp.1-2
Conference
2023 Implementation of silicon photonics-in-package (SiP) based 100Gbps PAM-4 chip-on-board (COB) and optical transceiver   Jyung Chan Lee   한국광학회 학술 발표회 (동계) 2023, pp.1-1
Conference
2022 Four Wave Mixing Effect on O-bnad LWDM4 Wavelength of PAM4-106Gbps Modulated Signal   정수용   Photonics Conference 2022, pp.1-2
Conference
2022 TEC power consumption of the 8 channel EML TOSA module   권원배   Photonics Conference 2022, pp.1-2
Conference
2022 Non-contact High Speed POB Solder Joint Process Using Laser Heating   권상진   Photonics Conference 2022, pp.1-2
Journal
2022 53 GBd PAM-4 fully-integrated silicon photonics transmitter with a hybrid flip-chip bonded laser   Sanghwa Yoo   Optics Express, v.30, no.23, pp.41980-41998 5
Conference
2022 Chip-On-Board Implementation of 106Gb/s PAM4 Silicon Photonics Transmit and Receive and its Real-Time Operation   Jyung Chan Lee   Optics and Photonics Congress 2022, pp.1-1
Conference
2022 Implementation of Low Power Consumption Optical Transmitter Module Platform   강은규   광전자 및 광통신 학술 회의 (COOC) 2022, pp.1-1
Conference
2022 100 Gbps Silicon Photonics Transmitter Technology   유상화   광전자 및 광통신 학술 회의 (COOC) 2022, pp.1-1
Conference
2021 Transmitter Optical Engine with Glass Interposer   김대선   Photonics Conference 2021, pp.1-2
Conference
2021 Cooling Performance of QSFP-DD800 Optical Transceiver for Datacenter Network   권상진   Photonics Conference 2021, pp.1-2
Conference
2021 A Study on the Method of Measuring Internal Humidity in Non-hermetic Packages   정수용   Photonics Conference 2021, pp.1-2
Conference
2021 Thermal Characteristic of the 800Gbps Non-hermetic Package   권원배   Photonics Conference 2021, pp.1-2
Conference
2020 Electrode Interconnection of Glass VIA and Ceramic Optical-bench by using localized Laser Heating for High-speed Optical Communication Module   권상진   Photonics Conference 2020, pp.1-2
Conference
2020 Thermal characteristics of TO package and flat package for cooled TOSA   권원배   광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2
Conference
2020 Study on multimode fiber based silicon photonics transceiver structure   염현웅   광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2
Conference
2020 90 degree wire bonding for 100 Gbps ROSA platform   강은규   광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2
Conference
2020 60GHz Glass interposer for optoelectronics packaging   김대선   광전자 및 광통신 학술 회의 (COOC) 2020, pp.1-2
Conference
2018 A Study on the 100Gbps CWDM4 TOSA Platform   정수용   한국통신학회 종합 학술 발표회 (하계) 2018, pp.1476-1477
Conference
2017 A Study on the Implementation of Automated System for Optical Packaging Manufacturing Process   유홍연   한국통신학회 종합 학술 발표회 (동계) 2017, pp.1105-1106
Journal
2016 Coupled-cavity-based Slow Light Metamaterials with Antireflection Structures   Sun-Goo Lee   Applied Physics Letters, v.109, no.22, pp.1-4 1
Journal
2016 Self-collimation-based photonic crystal Mach–Zehnder demultiplexer   Sun-Goo Lee   Journal of Optics, v.18, no.9, pp.1-7 7
Conference
2016 A Study on Bidirectional Optical Interconnection for I2C Interface   정수용   한국통신학회 종합 학술 발표회 (하계) 2016, pp.976-977
Conference
2016 워터쉐드 분할 영역을 이용한 광 커넥터 오염 물질 검출 방법   유홍연   영상 처리 및 이해에 관한 워크샵 (IPIU) 2016, pp.1-2
Journal
2015 Self-collimation-based photonic crystal Mach–Zehnder add-drop filters   Sun-Goo Lee   Journal of Physics D : Applied Physics, v.49, no.5, pp.1-7 5
Journal
2015 Market and Technology Trends in 100Gb/s Optical Transceiver   이종진   전자통신동향분석, v.30, no.1, pp.65-76
Journal
2013 Physical Media Dependent Prototype for 10-Gigabit-Capable PON OLT   Jongdeog Kim   ETRI Journal, v.36, no.2, pp.245-252 18
Journal
2012 Single package directly modulated laser bidirectional optical subassembly using a modified mini-dual-in-line package for 10 Gbps passive optical networks   Jong Jin Lee   Optical Engineering, v.51, no.12, pp.1-3 1
Journal
2011 10-Gbps Electroabsorptive Modulated Laser Bidirectional Optical Subassembly using Novel Two-window Flat Package for Passive Optical Network   Jong Jin Lee   Optical Engineering, v.50, no.12, pp.1-3 2
Journal
2011 Novel Color Combiner Composed of Red, Green, and Blue Laser Diodes and a Thermally Expanded Core Fiber Waveguide   In Hee Shin   Optical Engineering, v.50, no.9, pp.1-4 3
Journal
2011 Novel Bumping Material for Solder-on-Pad Technology   Kwang-Seong Choi   ETRI Journal, v.33, no.4, pp.637-640 31
Journal
2010 Low-Cost Coaxial-Type Single TO-can Bidirectional Optical Subassembly   K.-S. Lim   Electronics Letters, v.46, no.23, pp.1556-1557 10
Journal
2010 Compact Bidirectional Optical Subassembly Vertically Stacked with 1.25-Gbps Transmitter and 10-Gbps Receiver for Passive Optical Networks   Jong Jin Lee   Optical Engineering, v.49, no.11, pp.1-3 2
Conference
2010 Novel Solder-on-Pad (SoP) Technology for Fine-Pitch Flip Chip Bonding   Kwang-Seong Choi   International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.805-805 3
Conference
2009 Bi-Directional Optical Subassembly based on Optical Communication SOP Technology   강현서   Photonics Conference 2009, pp.1-2
Conference
2009 Thermal Performance of BOSA Module using LTCC   이종진   Photonics Conference 2009, pp.1-2
Journal
2009 Novel Bidirectional Optical Subassembly with Embedded Filter, 45-Degree Angle Polished Fiber Cladding and Etched Fiber Core   Sei Hyoung Lee   Optical Engineering, v.48, no.10, pp.100502-1-100502-3 0
Journal
2009 Optical Communications Convergence SOP Technology   임권섭   전자통신동향분석, v.24, no.1, pp.1-11
Journal
2008 Simultaneous Transmission of 2.5-Gb/s Baseband and 5.8-GHz-band Radio Frequency Signals on a Single Wavelength using Optical Diplexer and Mixed-signal Multiplexer   Kwon-Seob Lim   Optical Engineering, v.47, no.12, pp.1-3 0
Conference
2008 High Efficiency Core Mode Out-coupling Method and the Fiber In-line Optical Transceiver Fabrication using the Same   이세형   한국광학회 학술 발표회 (하계) 2008, pp.321-322
Conference
2008 Compact and Effective Method of Optical Signal Redirection using Core-to-Cladding Mode Coupling   Seihyoung Lee   광전자 및 광통신 학술 회의 (COOC) 2008, pp.118-119
Conference
2008 Power consumption of silicon based micro TEC   이종진   광전자 및 광통신 학술 회의 (COOC) 2008, pp.399-400
Conference
2007 Low Cost and High Performance Fibre In-line Bi-directional Optical Subassembly for Fibre-to-the-Home   Hyun Seo Kang   European Conference on Optical Communication (ECOC) 2007, pp.1-2
Journal
2007 Passive Alignment of Photodiode by using Visible Laser and Flip Chip Bonding   유정희   한국마이크로전자 및 패키징학회지, v.14, no.3, pp.7-13
Conference
2007 Excessive Power Penalty due to Strong External Reflection on an Isolator Free DFB Laser Diode Transmitter   Jong Jin Lee   Conference on Lasers and Electro-Optics/Pacific Rim (CLEO/PR) 2007, pp.1-2 0
Journal
2007 A Novel Low-Cost Fiber In-Line-Type Bidirectional Optical Subassembly   Kwon-Seob Lim   IEEE Photonics Technology Letters, v.19, no.16, pp.1233-1235 14
Conference
2007 Power penalty due to external reflection on an isolator free DFB transmitter   이종진   광전자 및 광통신 학술 회의 (COOC) 2007, pp.118-119
Conference
2007 Flip chip bonding methode using visible laser in Photodiode packaging   유정희   광전자 및 광통신 학술 회의 (COOC) 2007, pp.126-127
Journal
2006 Experimental and Theoretical Characterization of Optical Signal Out-Coupling through V-Grooved Optical Fiber Cladding   Sei Hyoung Lee   Optical Engineering, v.45, no.12, pp.1-3 4
Conference
2006 Bi-Directional Optical Transceiver Sub Assembly based on Optical Path Conversion Technique   강현서   Photonics Conference 2006, pp.1-2
Conference
2006 Fiber Pigtailing on Silicon V-Groove using Low Cost Reliable Galss Solder   이종진   Photonics Conference 2006, pp.1-2
Conference
2006 The Relative Intensity Noise due to Strong External Reflection Into the Isolator Free DFB Laser Diode Transmitter   Jong Jin Lee   Passive Components and Fiber-based Devices III (APOC) 2006 (SPIE 6351), v.6351, pp.1-6 0
Conference
2004 The mechanical reliability of optical fiber assembly using glass solder   이종진   Photonics Conference 2004, pp.505-506
Conference
2002 Low thermal shift and Low stress Ferrule design for butt coupling   이종진   Photonics Conference 2002, pp.637-638