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Yun Ho-Gyeong
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Low-Carbon Integration Technology Creative Research Section
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Type Year Title Cited Download
Conference
2024 Laser Assisted Bonding (LAB) technology using Laser Non-Conductive Paste (NCP) for Micro solder bumps   Ki-Seok Jang   International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.272-272
Conference
2024 Low-Carbon Epoxy-Siloxane Flux Technology for Fine-Pitch Solder Bump Interconnection   Gwang-Mun Choi   International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.164-164
Conference
2024 Sustainable Epoxy-Functionalized Vanillic Acid-Siloxane Nanocomposite Adhesive for Fine-Pitch Solder Bump Interconnection   G.M. Choi   European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1
Conference
2024 Heat dissipation evaluation of epoxy-boron nitride-based non-conductive films with high thermal conductivity for fine-pitch solder bump interconnection   J.H. Oh   European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1
Conference
2024 Micro-LED Bonding and Repair on Display Backplanes by Simultaneous Transfer and Bonding (SITRAB) Technology   Jungho Shin   International Meeting on Information Display (IMID) 2024, pp.1-1
Conference
2024 Chip-on-Wafer (CoW) Technology Utilizing LaserAssisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20m Pitch   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2024, pp.943-948
Conference
2024 Transfer, bonding, repair of LEDs via simultaneous transfer and bonding (SITRAB) technology   신정호   한국마이크로전자 및 패키징학회 학술 대회 2024, pp.1-1
Conference
2024 Process window of Laser Non-Conductive Paste for Flip-chip Laser-Assisted Bonding   엄용성   한국마이크로전자 및 패키징학회 학술 대회 2024, pp.43-43
Conference
2023 Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 3
Conference
2022 Isosorbide-Based Organic-Inorganic Hybrid Materials for Green Chemistry   Gwang-Mun Choi   Materials Research Society (MRS) Meeting 2022 (Fall), pp.1-2
Conference
2022 Micro/Mini LED Array Transferred onto a Flexible Substrate Using Simultaneous Transfer and Bonding (SITRAB) Process and Anisotropic Solder Film (ASF)   Jiho Joo   International Meeting on Information Display (IMID) 2022, pp.1-19
Conference
2022 Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 4
Journal
2022 MicroLED Transfer, Bonding, and Bad Pixel Repair Technology   최광성   전자통신동향분석, v.37, no.2, pp.53-61
Conference
2021 Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 11
Conference
2021 Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 5
Conference
2021 59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display   Kwang-Seong Choi   Society for Information Display (SID) International Symposium 2021, pp.841-844 5
Journal
2021 Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining   Gwang-Mun Choi   Polymers, v.13, no.6, pp.1-14 10
Conference
2020 Study on Epoxy-Solder Hybrid Underfill Material for Fine-Pitch Bonding Application   최광문   한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-1
Conference
2020 Development of LAB-based low thermal deformation bonding technology for PCT substrates that are vulnerable to thermal processes   이찬미   한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-14
Conference
2020 Low fume and No-cleaning Solder Wire Technology   장기석   한국마이크로전자 및 패키징학회 2020, pp.1-1
Conference
2020 Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2020, pp.1031-1036 9
Conference
2015 Various Concentrated KOH Activation of Non-Stacked Reduced Graphene Oxide for Supercapacitor   JuMi Kim   International Conference on Advanced Electromaterials (ICAE) 2015, pp.1-1
Conference
2015 Enhanced Transmittance of Substrate UV Cut-Off Film with Imprinted Moth-Eye   JuMi Kim   IUMRS International Conference on Advanced Materials (IUMRS-ICAM) 2015, pp.1-1
Journal
2015 Fast Diffusion Supercapacitors Via an Ultra-High Pore Volume of Crumpled 3D Structure Reduced Graphene Oxide Activation   Keunsik Lee  RSC Advances, v.5, no.75, pp.60914-60919 26
Journal
2015 Promising efficiency enhancement in cobalt redox couple-based back-illuminated dye-sensitized solar cells with titanium foil substrate   Myoung Kim   Journal of Power Sources, v.278, pp.32-37 15
Journal
2014 Influence of a Self-Assembled Monolayer on Indium-Zinc-Oxide Semiconductor Thin-Film Transistors   Yong Suk Yang   Journal of the Korean Physical Society, v.65, no.10, pp.1555-1558 0
Conference
2014 Fabrication and Evaluation of Al Paste with Bi2O3- B2O3-ZnO Glass Frit for Screen-printed Energy Devices   Bit-Na Kim   Energy, Materials, and Nanotechnology (EMN) Meeting 2014 (Fall), pp.235-236
Conference
2014 Electrochemical Behaviour of a New Transparent Conductive Oxide(TCO) Layer-less Cell Structure   Ho-Gyeong Yun   Energy, Materials, and Nanotechnology (EMN) Meeting 2014 (Fall), pp.234-235
Journal
2014 Improved Performance of Metal Foil-Based Dye-Sensitized Solar Cells with Low Porosity and Short Length of TiO2 Nanotube Underlayer   Myoung Kim   Electrochimica Acta, v.133, pp.610-614 8
Journal
2013 Technology Trend of Printed Electronics   양용석   전자통신동향분석, v.28, no.5, pp.111-121
Journal
2013 Electrochemical Analysis of Transparent Oxide-Less Photovoltaic Cell with Perforation Patterned Metal Substrate   Myoung Kim   Applied Physics Letters, v.102, no.18, pp.1-5 5
Journal
2013 A Study on Characteristics of Dye-Sensitized Solar Cells With Plasma-Treated TiO2 Films as a Function of Dye-Adsorption Time   Myoung Kim   Journal of Solar Energy Engineering, v.135, no.1, pp.1-4 0
Journal
2012 Tuned Optical Reflection Characteristics of Chemically-Treated Ti Substrates   Ho-Gyeong Yun   ETRI Journal, v.34, no.6, pp.954-957 1
Journal
2012 A quasi-solid-state dye-sensitized solar cell based on sol–gel derived in situ gelation of a siloxane hybrid electrolyte   Jun-Young Bae  RSC Advances, v.2, no.13, pp.5524-5527 15
Journal
2012 Cost-Effective Dye-Sensitized Solar Cells Consisting of Two Metal Foils Instead of Transparent Conductive Oxide Glass   Ho-Gyeong Yun   Physical Chemistry Chemical Physics, v.14, no.18, pp.6448-6451 13
Journal
2011 Novel Ionic Iodide-Siloxane Hybrid Electrolyte for Dye-Sensitized Solar Cells   KyungHo Jung  ACS Applied Materials & Interfaces, v.3, no.2, pp.293-298 22
Conference
2011 A Study on Characteristics of Dye-Sensitized Solar Cells based on Plasma Treated TiO2 Films in Terms of Dye-adsorption Time   Myoung Kim   Nano Korea 2011, pp.1-1
Conference
2011 An Importance of the Interface between TiO2 Nano-particles and Ti Substrate for Use in Dye-sensitized Solar Cells   윤호경   한국전기전자재료학회 학술 대회 (하계) 2011, pp.1-1
Journal
2011 A Simple and Highly Efficient Method for Surface Treatment of Ti Substrates for Use in Dye‐Sensitized Solar Cells   Ho-Gyeong Yun   Advanced Energy Materials, v.1, no.3, pp.337-342 39
Journal
2011 Dye-sensitized solar cells with TiO2 nano-particles on TiO2 nano-tube-grown Ti substrates   Ho-Gyeong Yun   Journal of Materials Chemistry, v.21, no.11, pp.3558-3561 44
Journal
2010 ZnO Nanosphere Fabrication Using the Functionalized Polystyrene Nanoparticles for Dye-Sensitized Solar Cells   Mi-Hee Jung   Electrochimica Acta, v.55, no.22, pp.6563-6569 22
Conference
2010 Increased Dye Adsorption on the TiO2 Surface by the Plasma Treatment   Myoung Kim   Aseanian Conference on Dye-sensitized and Organic Solar Cells 2010, pp.1-1
Conference
2010 CdSe/ZnS Core/Shell Quantum Dot-Sensitized Solar Cells on TiO2 Nanocrystalline Films   Mi-Hee Jung   International Conference on Nanotechnology (IEEE-NANO) 2010, pp.1-1
Journal
2009 40 Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Lasers Fabricated Using Selective Area Growth   Yong Hwan Kwon   ETRI Journal, v.31, no.6, pp.765-769 15
Conference
2009 The Energy Conversion Efficiency of ZnO Colloidal Nanocrystal Clusters and Nanosheet in Dye-Sensitized Solar Cells   Mi Hee Jung   International Photovoltaic Science and Engineering Conference (PVSEC) 2009, pp.1-1
Conference
2009 Dye-Sensitized Solar Cell with TiO2 Nano-Particles on the TiO2 Nano-Tube Grown Ti Substrates   Ho Gyeong Yun   International Photovoltaic Science and Engineering Conference (PVSEC) 2009, pp.1-2
Conference
2009 Dye-Sensitized Solar Cells based on Metal Substrates   Ho Gyeong Yun   International Conference on Frontier Photoscience and Functional Materials (ICFPFM & KJFP) 2009, pp.1-1
Journal
2008 Fabrication of an Efficient Dye-Sensitized Solar Cell with Stainless Steel Substrate   Jong Hyeok Park  Journal of the Electrochemical Society, v.155, no.7, pp.F145-F149 135
Journal
2008 Integration and Characteristics of 40-Gb/s Electroabsorption Modulator Integrated Laser Module With a Driver Amplifier and Bias Tees   Ho Gyeong Yun   IEEE Transactions on Advanced Packaging, v.31, no.4, pp.855-860 5
Journal
2008 Effect of Increased Surface Area of Stainless Steel Substrates on the Efficiency of Dye-sensitized solar Cells   Ho-Gyeong Yun   Applied Physics Letters, v.93, no.13, pp.1-3 64
Journal
2008 Fabrication and Characteristics of 40-Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules   Ho-Gyeong Yun   IEEE Transactions on Advanced Packaging, v.31, no.2, pp.351-356 10
Conference
2007 Characteristics of Amplifier-integrated 40 Gbps Optical Receiver and Transmitter Modules   Kwang-Seong Choi   Electronics Packaging Technology Conference (EPTC) 2007, pp.604-608 0
Conference
2007 High-Frequency Characteristics of 40Gb/s Electroabsorption Modulator-Integrated DFB Lasers: Effect of Traveling-Wave Electrode and Tilted Facet   Yong-Hwan Kwon   Asia-Pacific Microwave Conference (APMC) 2007, pp.1-4 4
Conference
2007 Characteristics of a Driver Amplifier Integrated 40 Gb/s EML Module   Ho-Gyeong Yun   Electronic Components and Technology Conference (ECTC) 2007, pp.1994-1999 2
Journal
2006 Right-Angle-Bent CPW for the Application of the Driver-Amplifier-Integrated 40 Gbps TW-EML Module   Ho Gyeong Yun   ETRI Journal, v.28, no.5, pp.648-651 8
Journal
2006 Widely Tunable Grating Cavity Lasers   Oh Kee Kwon   ETRI Journal, v.28, no.5, pp.545-554 8
Conference
2006 Grating Cavity Laser Integrated Mach-Zehnder Interferometers for Tunable Wavelength Conversion   Jong Hoi Kim   Passive Components and Fiber-based Devices III (APOC) 2006 (SPIE 6352), v.6352, pp.1-2 0
Conference
2006 Fabrication and Characteristics of 40 Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules   Ho Gyeong Yun   Electronic Components and Technology Conference (ECTC) 2006, pp.1687-1692 3
Conference
2005 포물선형 평행광 렌즈   Hyun-Soo Kim   Lasers and Electro-Optics Society (LEOS) 2005, pp.722-723 0
Journal
2005 광모드 변환기 집적된 도파로형 포토다이오드를 이용한 전단수신기의 제작   Yong-Hwan Kwon   ETRI Journal, v.27, no.5, pp.484-490 36
Journal
2005 Widely Frequency-Tunable Amplified Feedback Lasers for 10-GHz Optical Pulsation   Dae Su Yee  IEEE Photonics Technology Letters, v.17, no.6, pp.1151-1153 23
Conference
2004 Study on cost-effective WDM-PON system using RSOA   이우람   Photonics Conference 2004, pp.17-18
Journal
2004 Thermally controlled wavelength locker integrated in widely tunable SGDBR-LD module   Jongdeog Kim   IEEE Photonics Technology Letters, v.16, no.11, pp.2430-2432 5
Journal
2004 전기적 파장가변 외부공진기형 레이저 다이오드의 제안   Oh Kee Kwon   IEEE Photonics Technology Letters, v.16, no.8, pp.1804-1806 19
Conference
2004 반도체광전치증폭기가 집적된10Gb/s 마흐-젠더 파장변환기의 동적 입력 파워 범위의 증가   Hyun-Soo Kim   Optoelectronics and Communications Conference (OECC) 2004, pp.380-381
Conference
2004 전기적으로 조절가능한 외부 공진기형 파장가변 광원   Oh-Kee Kwon   Optoelectronics and Communications Conference (OECC) 2004, pp.382-383
Conference
2004 10 Gb/s All-Optical Mach-Zehnder Interferometric Wavelength Converter module with Monolithically integrated SOA preamplifiers.   김현수   COOC04, pp.193-194
Conference
2003 Electrical crosstalk analysis for gigabit optical transceiver module   Sung-IL Kim   Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR) 2003, pp.572-572 3
Conference
2003 Packaging technology for wavelength tunable filter based on optical MEMS   Yong-Sung Eom   IEEE LEOS International Conference on Optical MEMS 2003, pp.67-68 0
Conference
2003 Optical Design for 2D-MOEMS Switch Packaging   엄용성   광전자 및 광통신 학술 회의 (COOC) 2003, pp.437-378
Conference
2003 Optical design of tunable Ld module   최병석   광전자 및 광통신 학술 회의 (COOC) 2003, pp.535-536
Conference
2003 Mach-Zehnder interferometric wavelength converter with monolithically integrated semiconductor optical amplifiers for 40nm span   김종회   광전자 및 광통신 학술 회의 (COOC) 2003, pp.1-2
Conference
2002 Fabrication and measurement of waveguide photodiodes for 40 Gbps optical receiver   권용환   Photonics Conference 2002, pp.85-86
Conference
2002 Fabrication of 50GHz internal wavelength locker module for multi-channel tunable laser diodes in DWDM applications   박흥우   Photonics Conference 2002, pp.13-14
Journal
2002 Improving Thermal Performance of Miniature Heat Pipe for Notebook PC Cooling   Seok Hwan Moon   Microelectronics Reliability, v.42, no.1, pp.135-140 70
Journal
2001 Experimental study on the performance of miniature heat pipes with woven-wire wick   Seok Hwan Moon   IEEE Transactions on Components and Packaging Technologies, v.24, no.4, pp.591-595 16