ETRI-Knowledge Sharing Plaform

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Kgaa High Bandwidth Memory(HBM) High Thermal Conductivity Intensity Modulated Photovoltage Spectroscopy(IMVS) Total Power Consumption Chemical Bonding Design Factors Electrochemical Analyses Glass Transition Temperature Material System Open-Circuit Voltage Decay Deeply Etched Dry Etching Processes Enhanced Transmittance Environmentally Friendly International Competitiveness Large Area Oxide Semiconductor Organic-Inorganic Hybrid Materials Pulsation Frequency Zno Nanoparticle Infrastructure Support Optical Module Printed Electronics Package-On-Package Resist Layer Differential Scanning Calorimetry (Dsc) Itu Grid Electrical Control Boron Nitride Chemical Stability Electrical Resistance Measurements Integrated Waveguide Integration Technology Light Output Multi-Channel Post-Treatment Rapid Cooling Surface Morphology Module Design Radio Frequency (Rf) Tunable Filters(TFs) Wavelength Locking Artificial Intelligence Adverse Effects Bonding Technique Flux Residues Oxide Glass Simulation Results Situ Gelation Cooling Systems Dye Molecules Electrochemical Analysis Fast Diffusion Inkjet-Printed Light-To-Electricity Conversion Efficiency Mechanical Performance Aspect Ratio Carbon Epoxy Crosstalk Analysis Cobalt Redox Couple High Coupling Efficiency High Transmittance Improved Thermal Stability Microstructural Analysis Pore Diameter Photo-Electrode Production Space Wavelength Locker Bonded Joints Energy Devices Polystyrene Nanoparticles Post-Process Research Institute Transient Measurements Simple Design Energy Field Overall Efficiency Quasi-Solid-State Dye-Sensitized Solar Cell Sem Images Electroless Plating Imc Thickness Optical Communications Titanium Foil Sno 2 Silicon Chips Manufacturing Cost Digital Signage Electron Transfer Figures Of Merit Growth Method Insertion Loss Metal Substrate Flip-Chip Bonding Transfer Properties Wall Thickness Wafer Level Submicron-Sized Optical Reflection One-Step Preparation Pore Distribution Thermal Performance Tapered Waveguide Case Temperature Development Trends Inp Material Market Demand Mass Transfer Mobile Application(APP) Application Areas Fill Factor(F.F.) Glass Frit Glass Wafer Intermetallic Compound (Imc) Optical Behavior Photovoltaic Characteristics Particle Diameter Pore Size Distribution Working Fluid Wavelength Monitoring Self-Pulsation Surface Mount Technology Core-Shell Quantum Dots Cell Efficiency Concentrated Koh Electronic System Heat Transfer Limit Process Efficiency Screen-Printed Solar Cell Si Substrate Dbr Mirrors Efficiency Enhancement Large-Scale Moth-Eye Nitride-Based Thin-Film Transistor(TFT) Semiconductor Packaging Adsorption Reaction Coin Cell Cell Structure High-Density Three Dimensional(3D) Functionalized Polystyrene Uv Laser Zno Films Active Matrix Cross-Sectional Area(CSA) Cycle Time Heat Flux Input Power J Sc Short Process N719 Dye And Systems High-Performance Computing(HPC) Mechanical Reliability Multiple Beam Oxide Layer Resistance Variation Bias Tee Cmos Technology Diffusion Rate Grating Mirror Light Scattering Effect Thermochemical Reaction Technology Infrastructure Transparent Oxide Wide Tuning Range Waveguide Photodiodes(WGPD) Reduced Recombination Cavity Length L-Glutamic Acid(Poly) Maximum Energy Density Organic Electrolyte Post-Curing Reducing Agent Water-Soluble Applied Current Dynamic Range Electrical Crosstalk Key Components Thermal Polymerization Thermal Resistance Temperature Cycling Simultaneous Effects Cobalt Electrolyte Cut-Off Curing Process Dark Current Gigabit Transceiver High Ionic Strength Optical Alignment Photoelectrochemical Devices High Reliability Thermal Load Wavelength Conversion(WC) Photovoltaic Module(PV) Semiconductor Optical Amplifiers(SOAs) Zno Nanosphere Short Circuit Current Density Laser Wavelength Alignment Tolerance High Specific Capacitance Inkjet Printing Improved Performance Living Systems Positional Accuracy Wavelength-Division-Multiplexing Passive Optical Network(WDMPON) Fabry-Perot Cavity Micro-Led Array Photovoltaic Cell(PV) Yield Management Superior Performance Context Aware Ionic Iodide Integrated Module Performance Requirements Polymeric Networks Vanillic Acid Broader Bandwidth Patterned Substrate Reflow Process Surface Finishes Bad Pixel Colloidal Nanocrystal Clusters Junction Temperature Transparent Conducting Single-Mode Laser 3d Display Epoxy-Based HNO 3 High Power Light-Emitting Diodes (Leds) Particle Size Reduced Charge Recombination Bisphenol F Cure Process Liquid-Crystal Display(LCD) Smart Vehicle V Oc Sulfuric Acid(SA) Electron Lifetime Electron Recombination High Electrical Conductivity Output Power Wavelength Tunable Sustainable Technologies Echelle Grating High-Productivity Advanced 3d Cost Efficiency Dfb-Ld Module Front-End Heat Treatment Indium Zinc Oxide Model-Based Polymer Chain Tuning Rate Void Formation Thermal Stress Beam Divergence Angle Constant Temperature And Humidity Printing Technique Ag Electrode Adhesive Technology Base Matrix Contact Area Eco-Friendly Materials Flexible Substrate High Responsivity Ir Laser Mechanical Robustness New Method Packaging Structure Sampled-Grating Distributed Bragg Reflector Laser Blocking Layer Crosstalk Reduction Circle Construction Electroabsorption Modulated Laser(EML) Novel Material Printing Method 3d Structures Solder Joint Distributed Feedback Lasers(DFBs) Metal Mesh Pore Volume Quantum Dot-Sensitized Solar Cells 7 Mm