Conference
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2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Ki-Seok Jang
Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
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Conference
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2024 |
Never drying solder paste at room temperature for semiconductor packaging process
엄용성
대한전자공학회 학술 대회 (하계) 2024, pp.3344-3345 |
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Conference
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2024 |
Micro-LED display fabrication method using simultaneous transfer and bonding (SITRAB) technology
신정호
대한전자공학회 학술 대회 (하계) 2024, pp.3346-3347 |
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Conference
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2024 |
Development of a Full-Color MicroLED Display Utilizing Novel Simultaneous Transfer and Bonding (SITRAB) Process and SITRAB Film Technology
Jiho Joo
Society for Information Display (SID) International Symposium 2024, pp.1309-1312 |
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Conference
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2024 |
Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology
Jungho Shin
Society for Information Display (SID) International Symposium 2024, pp.1278-1281 |
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Journal
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2024 |
Process window of simultaneous transfer and bonding materials using laser-assisted bonding for mini- and microLED display panel packaging
Yong-Sung Eom
ETRI Journal, v.46, no.2, pp.347-359 |
5 |
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Conference
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2024 |
Process window of Laser Non-Conductive Paste for Flip-chip Laser-Assisted Bonding
엄용성
한국마이크로전자 및 패키징학회 학술 대회 2024, pp.43-43 |
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Conference
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2024 |
Transfer, bonding, repair of LEDs via simultaneous transfer and bonding (SITRAB) technology
신정호
한국마이크로전자 및 패키징학회 학술 대회 2024, pp.1-1 |
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Conference
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2023 |
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Ki-Seok Jang
European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
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Conference
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2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Yong-Sung Eom
European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
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Conference
|
2023 |
Highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology
Jiho Joo
International Meeting on Information Display (IMID) 2023, pp.1-1 |
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Conference
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2023 |
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 |
3 |
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Conference
|
2023 |
Development of Bonding Technology of HBM2-Level Stacked Chip with Reliability using Developed Electroplating Materials
엄용성
한국표면공학회 학술 대회 (춘계) 2023, pp.70-70 |
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Conference
|
2023 |
Development of a highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology
Jiho Joo
Society for Information Display (SID) International Symposium 2023, pp.433-436 |
2 |
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Conference
|
2022 |
Isosorbide-Based Organic-Inorganic Hybrid Materials for Green Chemistry
Gwang-Mun Choi
Materials Research Society (MRS) Meeting 2022 (Fall), pp.1-2 |
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Conference
|
2022 |
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
Ki-Seok Jang
Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 |
2 |
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Conference
|
2022 |
Micro/Mini LED Array Transferred onto a Flexible Substrate Using Simultaneous Transfer and Bonding (SITRAB) Process and Anisotropic Solder Film (ASF)
Jiho Joo
International Meeting on Information Display (IMID) 2022, pp.1-19 |
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Conference
|
2022 |
Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)
Jiho Joo
Electronic Components and Technology Conference (ECTC) 2022, pp.619-624 |
1 |
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Conference
|
2022 |
Development of Flexible full-color Mini-LED display using simultaneous transfer and bonding (SITRAB) technology
주지호
대한전자공학회 학술 대회 (하계) 2022, pp.1-2 |
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Conference
|
2022 |
Interconnection Reliability of Mini LEDs for Display Applications
In-Seok Kye
Electronic Components and Technology Conference (ECTC) 2022, pp.1184-20 |
0 |
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Conference
|
2022 |
Evaluation of Solder Wetting and Screen-Printing with Dry-Free Solder Paste
장기석
대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-13 |
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Conference
|
2022 |
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 |
4 |
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Conference
|
2022 |
Interconnection Reliability Analysis of Mini-LEDs for Display Applications
In-Seok Kye
대한용접접합학회 학술 발표 대회 (춘계) 2022, pp.1-19 |
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Conference
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2022 |
Development of Flexible Full-Color Mini-LED Display Using Simultaneous Transfer and Bonding (SITRAB) Technology
Jiho Joo
Society for Information Display (SID) International Symposium 2022, pp.1005-1008 |
12 |
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Conference
|
2022 |
Dry-Free Solder Paste with No Viscosity change at R.T. & No Adhesion change after Screen-Printing Process
장기석
한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-1 |
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Conference
|
2022 |
Comparison of mini-LED bonding using ACF(Anisotropic conductive film) and ASF(Anisotropic solder film)
이찬미
한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2 |
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Conference
|
2022 |
Development of Mini-LED display using simultaneous transfer and bonding (SITRAB) technology
주지호
한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2 |
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Conference
|
2021 |
Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 |
11 |
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Conference
|
2021 |
Development of Simultaneous Transferring and Bonding (SITRAB) Process for μLED Arrays Using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
Jiho Joo
Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 |
5 |
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Conference
|
2021 |
Simultaneous Transfer and Bonding (SITRAB) Process for Mini-LED Display
Kwang-Seong Choi
Society for Information Display (SID) International Symposium 2021, pp.841-844 |
4 |
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Journal
|
2021 |
Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
Gwang-Mun Choi
Polymers, v.13, no.6, pp.1-14 |
9 |
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Conference
|
2020 |
Low fume and No-cleaning Solder Wire Technology
장기석
한국마이크로전자 및 패키징학회 2020, pp.1-1 |
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Conference
|
2020 |
Development of LAB-based low thermal deformation bonding technology for PCT substrates that are vulnerable to thermal processes
이찬미
한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-14 |
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Conference
|
2020 |
Study on Epoxy-Solder Hybrid Underfill Material for Fine-Pitch Bonding Application
최광문
한국마이크로전자 및 패키징학회 학술 대회 2020, pp.1-1 |
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Conference
|
2020 |
Development of film-based ultra-compact GaAs photovoltaic module using Laser-Assisted Bonding
Jiho Joo
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2020, pp.1-1 |
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Journal
|
2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
엄용성
전자통신동향분석, v.35, no.4, pp.1-10 |
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Conference
|
2020 |
Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2020, pp.1031-1036 |
9 |
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Conference
|
2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo
Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
10 |
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Conference
|
2019 |
Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
Yong-Sung Eom
European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 |
0 |
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Journal
|
2018 |
NDR-effect Vertical-illumination-type Ge-on-Si Avalanche Photodetector
GYUNGOCK KIM
Optics Letters, v.43, no.22, pp.5583-5586 |
15 |
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