ETRI-Knowledge Sharing Plaform

Schottky Barrier Diode(SBD) Power Semiconductor Dc-Dc Converters Forward Current Multilayer Circuit Silicon Carbide(3C-SiC) Reverse Recovery Charge Power Inductor Power Conversion System Algan/Gan-On-Si Power Losses Sic Sbd Electrical Characteristics Breakdown Voltage(BDV) Input Voltage Dry Etch Channel Width 700 V High Electron Mobility Transistor(HEMT) Normally-Off Stray Inductance Load Regulation Load Change Load Conditions Dynamic Characteristics Wheel Motor Temperature Humidity Bias(THB) Power Factor Correction (Pfc) Converter Full-Load Commercial Products Reverse Leakage Current High Temperature Storage High Current Dynamic Load Electric Bike Output Power Switching Characteristics Trade-Off Forward And Reverse Dbc Substrate Electromagnetic Interference Semiconductor Package Switching Loss Storage Life Gate Bias High Thermal Conductivity Line Regulation Low Current Multi-Layer Substrate Electrical Resistance Performance Analysis Theoretical And Experimental Analysis High Power Conversion Efficiency Low Parasitic Inductance Algan/Gan Hfet Boost Converter Control Scheme Reverse Voltage Low Voltage Class B Efficiency Improvement Turn-Off Parasitic Effects Power Electronics Permanent-Magnet(PM) Structural Changes Low Turn-On Voltage Low Switching Conversion Systems Supply Voltage Temperature Test Low Loss Back Electromotive Force Blocking Voltage Channel Length Dual Stack Drain Voltage Enhancement-Mode Device Packaging Electrical Engineers Motor System Motor Dynamics Output Voltage 48 V 3 V 3.5 Ghz Pulse Generator Switching Noise Reliability Testing 16 Nm Switching Conditions System Architecture Signal Line Mesa Etching Anode Structure Conduction Loss Device Size Drain Leakage Current Direct Current Resistance(DCR) Non-Doped Virtual Shaft Snap-Back Power Signal Power Handling Capability Physical Model Process Technology Peak Current Reverse Bias Radiated Emission Reverse Recovery Time Silicon Substrate Small Form Factor Single-Input Gate Recess High Reliability High Switching Frequency High Power Applications Inverter Topology Lateral Dimensions Air-Core Buck Converter Current Collapse Control Lines Dynamic Test Electro-Static Discharge(ESD) Double-Pulse Noise Mitigation Small Size Semiconductor Packaging 2 Mm Switching Device Topology Design Theoretical Analysis Power Converter Pulse Power Rf Receiver Si-Based Switching Power Zero-Voltage Switching Storage Temperature Soft Switching Stabilization Time High Power Density Interference Test Inductance Extraction Lift-Off Process Drain Current Etching Process Electrical Energy Extraction Method Numerical Simulations Output Stability 1200 V Ceramic Layers Thermal Vias Reverse Current Printed Circuit Board(PCB) Sic Mosfet Rotational Symmetry Smd Package Synchronous Buck High-Density Input And Output Hard Switching Heat Transfer Loss Characteristics Metal-Insulator-Semiconductor(MIS) Average Efficiency Design And Analysis Dual Output Converter Driving Capability Magnetic Dipole Metal Layer Self-Aligned Surface Mount Device Static And Dynamic Performances Thermal Cycling Torque Analysis Thermal Oxidation Fluorine Ions Hemispherical Shell Half-Bridge Power Module Large-Scale Attitude Error As 2 Al Film Aluminum Wires Bonding Structure Dynamic Ron Mechanical Operation Mobile Application(APP) Oxide-Semiconductor Field-Effect Transistors Output Ripple Simulation And Experiment Thick Copper Embedded Cavity Power Limiter Power Device Power Factor Correction Converter Reflection Loss Surface Passivation Self-Heating Gan Mis-Hemt Input Power High Voltage High-Efficiency Converter Heat Dissipation Rate Low Leakage Current Low Temperature Co-Fired Ceramic (Ltcc) Substrate Level Shifter MOS-HEMT Design Evaluation Electrical Properties(I-V curve) On-State Characteristics Off-State Stress Transmission Line Working Temperature True-Time Delay Radio Frequency(RF) Rated Power Resistive Component Surface Acting Gan On Sic Gate Fabrication Gate Leakage Gan Hfets Human Body Model(HBM) High Performance In-Situ Lead Free Solder Alloy Low Threshold Voltage Battery Voltage Battery Electric Vehicles Ceramic Substrate Design And Control Degradation Rate Depletion Mode Explicit Methods Metal-Oxide-Semiconductor Field-Effect Transistor(MOSFET) New Type Wire Bonding Voltage Performance Saturation Current On-Resistance Pin Diode Plasma Treatment Quality-Factor(Q-factor) Recessed Gate S-Band Forward Voltage Insertion Loss Anode And Cathode Brushless Dc (Bldc) Motor Cascode Gan Fet Cross Regulation Circumferential Air Cost-Effective Direct Bonded Copper(DBC)