ETRI-Knowledge Sharing Plaform

Power Module Heat Dissipation Thermal Analysis High Power Maximum Temperature Insulated Metal Substrate Low Thermal Conductivity Coefficient Of Thermal Expansion Direct Bonded Copper(DBC) Ag Sintering Clip Bonding Interfacial Reliability High Temperature High Thermal Conductivity Power Semiconductor High-Strength Bonding Material Micro-Nano Touch Sensor Thermal Shock Test Electrical Properties(I-V curve) Highly Reliable Insulation Properties Integrated Structure Sintering Condition Shock Reliability Semiconductor Technology Poly-Ether-Ether-Ketone Wire Bonding Nano-Ag Top Metal Reliability Analysis Sandwich Structure Analysis And Simulation Copper Layer Cu Paste Co-Simulation Comsol Multiphysics Electronic Circuit Shear Tests Nano-Particle Thermal Cycle Testing Dielectric Films Hydrogenated Amorphous Silicon Heat Stability Sintering Of Cu Sic Mosfet 3d Printer Temperature Difference Thermal Cycling Amorphous Silicon Solar Cells Al Wire Dbc Substrate Electric-Thermal Laser Sintering Thermal And Mechanical Properties Silicon-Based Numerical Analysis Ag Paste Development Stage Glass Frit Large-Scale Applications Theoretical Performance Bond Strength Die-Attach Energy Dispersive X-Ray Spectroscopy(EDX) High Mechanical Properties Mechanical Stress Wide Bandgap Devices Wide Bandgap Semiconductor Ambient Conditions Direct Bonding Device Reliability Electronic Packaging Heat-Resistance Insulating Layer Industry Standard Electrical Characteristics Sic Power Devices Power Electronics 3d Printing Technology Thermomechanical Stability Amount Of Heat Dissipation Capacity Electrical Reliability Electric Vehicle(EV) Inert Atmosphere Interfacial Debonding Low Temperature Bonding Mechanical Strength Substrate Structure Sintering Process Low-Cost