|
Conference
|
2024 |
Results of SiC and GaN Power Module Manufacturing with Non-Pressure Ag Sintering Paste
오애선
SiC 반도체 컨퍼런스 2024, pp.53-53 |
|
|
|
Conference
|
2024 |
Improved thermal shock reliability of AlN substrates with high heat dissipation for electric vehicles
배현철
SiC 반도체 컨퍼런스 2024, pp.52-52 |
|
|
|
Conference
|
2023 |
Analysis of Heat Dissipation Characteristics of Power Modules with Different Top Metal and Bottom Metal Thicknesses of Insulated Metal Substrate
박성효
대한전자공학회 학술 대회 (하계) 2023, pp.116-119 |
|
|
|
Conference
|
2023 |
Manufacturing of power module using base plate integrated Insulted metal substrate
배현철
한국전기전자재료학회 학술 대회 (하계) 2023, pp.1-1 |
|
|
|
Journal
|
2023 |
Thermal Design of High Power Semiconductor Using Insulated Metal Substrate
정봉민
마이크로전자 및 패키징학회지, v.30, no.1, pp.63-70 |
|
|
|
Conference
|
2023 |
Thermal-Electrical Co-Simulation for Package Heat Dissipation Design
Bongmin Jeong
한국반도체 학술대회 (KCS) 2023, pp.1-1 |
|
|
|
Conference
|
2023 |
Measurement and comparison of low dielectric constant and loss characteristics of PCB material for 5G and Ka band
배현철
한국전자파학회 종합 학술 대회 (동계) 2023, pp.250-250 |
|
|
|
Conference
|
2022 |
Effect of Carbon Fiber and Glass Fiber on Thermo-mechanical Property of Polyether Ether Ketone for Power Module case of Electric Vehicle
손기락
한국복합재료학회 학술 발표 대회 (추계) 2022, pp.197-197 |
|
|
|
Journal
|
2022 |
Thermal shock reliability of micro-nano bimodal Cu-Ag sintered joints
Kirak Son
Journal of Materials Science : Materials in Electronics, v.33, pp.17493-17501 |
2 |
|
|
Conference
|
2022 |
Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate
Bongmin Jeong
International Conference and Exhibition on High Temperature Electronics Network (HiTEN) 2022, pp.66-70 |
|
|
|
Conference
|
2022 |
Thermal Dissipation Characteristics of Insulated Metal Substrate for SiC Power Conversion Module
배현철
한국전기전자재료학회 학술 대회 (하계) 2022, pp.1-1 |
|
|
|
Conference
|
2022 |
Correlation between the Mechanical Strength and Crystallinity of 3D- Printed PEEK Materials
Kyung-Hyun Kim
Materials Research Society (MRS) Meeting 2022 (Spring), pp.1-1 |
|
|
|
Conference
|
2022 |
A Study on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on DBC/AMB Substrates for Power Module
Kirak Son
한국반도체 학술대회 (KCS) 2022, pp.369-369 |
|
|
|
Conference
|
2022 |
DBC and IMS for Electric Vehicle Power Module Heat Dissipation Comparsion
정봉민
한국반도체 학술대회 (KCS) 2022, pp.427-427 |
|
|
|
Conference
|
2021 |
Measurement of PCB ielectric constant and loss using T-resonatorin the millimeter wave band
박은영
대한전자공학회 학술 대회 (추계) 2021, pp.90-92 |
|
|
|
Conference
|
2021 |
Effect of Sintering Process on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on Power Electronics Substrate
Kirak Son
International Symposium on Microelectronics and Packaging (ISMP) 2021, pp.1-1 |
|
|
|
Conference
|
2021 |
Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material
Dong-Hwan Kim
Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 |
3 |
|
|
Conference
|
2021 |
Thermal analysis of SiC power module using high heat dissipation DBC/AMB substrate and bonding material with high thermal conductivity
김동환
한국 반도체 학술 대회 (KCS) 2021, pp.258-258 |
|
|
|
Conference
|
2021 |
TO 247 module manufacture and Characteristic measurement using high heat dissipation bonding material
오애선
한국 반도체 학술 대회 (KCS) 2021, pp.432-432 |
|
|
|
Conference
|
2021 |
Fabrication of Cu Trace Touch Sensor by Laser Sintering of Cu Micro-Nano Particle Paste on 3D -printed Substrate
안현식
한국 반도체 학술 대회 (KCS) 2021, pp.512-512 |
|
|
|
Conference
|
2021 |
Pressureless bonding of high heat dissipation nano/micron Cu Sintering Paste for SiC power module
배현철
한국 반도체 학술 대회 (KCS) 2021, pp.255-255 |
|
|
|
Journal
|
2021 |
Fabrication of Cu Wiring Touch Sensor via Laser Sintering of Cu Nano/Microparticle Paste on 3D-Printed Substrate
Hyeon-Sik Ahn
Advanced Engineering Materials, v.23, no.1, pp.1-9 |
3 |
|
|
Conference
|
2020 |
Thermal analysis of power module using high heat dissipation substrate and bonding material
김동환
대한전자공학회 학술 대회 (하계) 2020, pp.151-154 |
|
|
|
Conference
|
2020 |
High heat dissipation bonding for power semiconductors
배현철
대한전자공학회 학술 대회 (하계) 2020, pp.167-169 |
|
|
|
Conference
|
2019 |
Cu sintering paste for EV power module
Hyuncheol Bae
International Conference on Advanced Electromaterials (ICAE) 2019, pp.1-1 |
|
|
|
Conference
|
2019 |
Development of high thermal Cu sintering paste for EV module
배현철
SiC 반도체 컨퍼런스 2019, pp.1-1 |
|
|
|
Conference
|
2019 |
Low Temperature Bonding for Transparent Hydrogenated Amorphous Silicon Solar Cell
Hyun-Cheol Bae
Global Photovoltaic Conference (GPVC) 2019, pp.219-219 |
|
|
|
Conference
|
2019 |
Bonding process for transparent Solar Cell Based on Silicon Thin Film
오애선
한국 반도체 학술 대회 (KCS) 2019, pp.524-524 |
|
|
|
Conference
|
2019 |
Development of high heat-dissipating Cu-based bonding material and power module for electric vehicles
배현철
한국 반도체 학술 대회 (KCS) 2019, pp.264-264 |
|
|
|
Conference
|
2018 |
Bonding process for large-area transparent solar cell based on silicon thin-film
배현철
한국태양광발전학회 학술 대회 (추계) 2018, pp.249-249 |
|
|
|
Conference
|
2018 |
Bonding of Amorphous Silicon Thin Film Solar Cell Using Glass Frit Paste
배현철
한국태양광발전학회 학술 대회 (추계) 2018, pp.250-250 |
|
|
|
Conference
|
2018 |
Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste
In-Hoo Kim
International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4 |
|
|
