ETRI-Knowledge Sharing Plaform

Power Module Heat Dissipation Thermal Analysis Low Thermal Conductivity Maximum Temperature Insulated Metal Substrate Coefficient Of Thermal Expansion High Power Direct Bonded Copper(DBC) Micro-Nano Power Semiconductor High Strength Interfacial Reliability High Thermal Conductivity Sic Mosfet High Temperature Ag Sintering Bonding Material Clip Bonding Ag Paste Co-Simulation Sintering Of Cu Wire Bonding Wide Bandgap Semiconductor Energy-Dispersive X-Ray Spectroscopy Electrical Reliability Sintering Condition Die-Attach Sic Power Devices Hermetic Package Mechanical Stress Dielectric Films Theoretical Performance Electric-Thermal Numerical Analysis Nano-Ag Thermal Shock Test Dbc Substrate Cu Paste Low-Cost Highly Reliable Heat-Resistance Pin Diode Thermal Cycling Top Metal Amount Of Heat Nano-Particles Thermal Cycle Testing Industry Standard 3d Printing Technology Insulating Layer Poly-Ether-Ether-Ketone Laser Sintering Integrated Structure Electrical Properties 3d Printer Power Electronics Temperature Difference Direct Bonding Reliability Analysis Large-Scale Applications Shock Reliability Shear Tests Hydrogenated Amorphous Silicon Semiconductor Technology Development Stage Inert Atmosphere Glass Frit Heat Stability Copper Layer Silicon-Based Substrate Structure Analysis And Simulation Interfacial Debonding Thermal And Mechanical Properties Amorphous Silicon Solar Cells Electric Vehicles(EV) Wide Bandgap Devices Thermomechanical Stability Ambient Conditions Touch Sensor Mechanical Strength Al Wire Bond Strength Sandwich Structure Electronic Packaging Comsol Multiphysics Electronic Circuit Dissipation Capacity High Mechanical Properties Low Temperature Bonding Device Reliability Electrical Characteristics Sintering Process Insulation Properties