ETRI-Knowledge Sharing Plaform

High Performance Solution-Processed Gate Dielectric Metal Oxide Thin Film Transistors Active Layer Organic Field-Effect Low-Cost Oxide Tfts Dielectric Layer Turn-On Voltage Dielectric Films Facile Route Subthreshold Swing(SS) On/Off Current Ratio Self-Aligned Plastic Substrate First Stokes(S1) Low Voltage Channel Length Manufacturing Processes Annealing Conditions Electrical Properties(I-V curve) Hybrid Materials Indium-Free Low-Power Sn-Rich Transfer Characteristics Thin Film Encapsulation Cyclic Olefin Copolymer Zinc Tin Oxide On/Off Ratio Semiconductor Device Threshold Voltage(Vth) Drain Bias Large-Area Electronics And Gate Al-Doped Deep Submicron Uv Exposure Bottom Gate Channel Layer Complementary Metal-Oxide-Semiconductor(CMOS) Device Performance Practical Application High Mobility Hole Mobility Solution-Processable Potential Applications Active Devices Flexible Electronics Insulating Properties Water Vapor Transmission Rate Thermal Annealing High Capacitance Inkjet Printing Zno/Sno 2 Uv Light Uv Annealing Water Absorption N-Type Nano-Gap Oxygen Gas Tips-Pentacene Tio2 Nanoparticles Top-Emitting Organic Light-Emitting Device(TE-OLED) Repulsive Force Active Channel Aligned Silver Nanowire Annealing Atmosphere Copolymer Layers Crack-Free Colloidal Stability Doped Polymer Encapsulation Process Electrical Conductivity(EC) Excellent Flexibility Flexible Oled High Voltage Heterojunction Structure Inorganic Thin Films Low Temperature Fabrication Low Surface Roughness Charge Transfer Injection Control Polymeric Substrates Polyethylene Naphthalate Propylene Carbonate Visible Light Transmission Electron Microscopy(TEM) Next-Generation Optimum Thickness P-Type Tin Oxide Three-Arm Toxic Chemicals Tft Array Resolution Limit Artificial Intelligence Bottom Contact Channel Thickness Composite Electrode Crystalline Structure Double-Channel Driving Current Earth-Abundant Materials Electrical Performance Electron Injection Energy Efficiency Functional Materials Hysteresis-Free Grazing Incidence X-Ray Diffraction Gate Bias Stress Highly Conductive Inverted Staggered Key Performance Low Operating Voltage Metal Oxide Thin Films Metal-Oxide-Semiconductor Field-Effect Transistor(MOSFET) 460 Nm Need For Rolled-Up Severe Bending Semiconductor Manufacturing Silver Nanowires(AgNWs) Straight Line Sol-Gel-Derived Printing Technique Precursor Solution Thermoelectric Generator(TEG) Optimum Condition Organic Semiconductors Oxide Material Oxide Thickness Three Dimensional(3D) Room-Temperature Amphiphilic Polymer Annealing Process Current Path Cooling Solution Conductive Electrodes Crystalline Morphology Cost-Effective Quantum-Dot Light-Emitting Diodes(QLEDs) Electron Microscopy Analysis Flexible Display Film Thickness High-K Zirconium Oxide Gate Leakage Current High Responsivity Highly Efficient In-Memory Lighting Applications Logic Devices Main Current Solvent-Assisted Stretchable Displays Surface Morphology Subthreshold Slope(SS) Performance Metrics P-Type Characteristics Poly(Ethylene Oxide)(PEO) Thin Film Materials Temperature Gradient Well-Defined Novel Material Thin-Film Phototransistors(TFPT) Tin(Ii) 2-Ethylhexanoate Trap Sites Thin Barrier Films Thermal Treatments Carbon Atoms Carrier Concentration Composite Film Different Thicknesses Hexagonal Lattice Hall Mobility Mechanical Flexibility Memory Applications P-Type Organic Semiconductor P-Channel Voltage Transfer Titanium Oxide Anneal Temperature New Method Oxide-Semiconductor Field-Effect Transistors Organic-Inorganic Hybrid Optical Properties Pen Substrates Surface Modification Ambient Air Cone-Jet Mode Deep Uv Device Characteristics Dielectric Strength Dispersed Nanoparticles Functional Group Free Volume Fabrication Method Fabrication And Characterization High Field-Effect Mobility High Temperature Semiconductor Heterojunction Mechanical Properties(PMCs) Practical Use Post-Anneal Protective Layer Printing Process Persistent Photoconductivity Power Integrated Circuits P-Type Oxide Semiconductor Plasma-Enhanced Atomic Layer Deposition 2 H 2-Dichlorobenzene Zn-Sn-O(ZTO) Thin Film Thermoelectric Thermoelectric Thin Film Uv-Assisted Oxide Semiconducting Materials Oxide Layer Oxide Electronics Organic Electronic Optical Transmittance Organic Complementary Inverters Two-Dimensional(2D) Tri-Layer Technical Issues Tin (Iv) Oxide Amorphous Indium-Gallium-Zinc Oxide(a-IGZO) Double Layer Display Applications Drain-Induced Barrier Lowering(DIBL) Environmental Stability External Bias Eco-Friendly Electronic Materials And Devices Field Emission Scanning Electron Microscopy(FESEM) Gas Barrier Films High Dielectric Constant Hybrid Thin Film Hole Transport Layer Hydrophobic Polymer Image Sensor Low Leakage Current Density Light Emitting Devices Low Temperature Heat Mass Production Reduced Graphene Oxide(rGO) Synthetic Strategy Smooth Surface Photo-Annealing Photo-Stability Polymer Substrate Optimized Condition Oxide Transistors Organic Thin-Film Transistors (Otfts) Optoelectronic Devices Specific Detectivity Tin Oxide Films Bending Cycles Back-Channel Etching Corrosion Tests Close-Packed Carrier Mobility Complementary Logic Gates Densely Packed Electrical Characteristics Electric Power Generation Flexible Electronic Devices Form Factor Graphene Films Go Sheets High Glass Transition Temperature Highly Crystalline High Photoresponsivity Inorganic Material Key Role Low Annealing Temperature Large-Area Graphene Mechanism Of Formation Reactive Gas Highly Stable Power Electronics Power Electronic Devices Patterning Process Photo-Generated Holes Production Operations Thermoelectric Materials Thermoelectric Figure Of Merit Transparent Electronics Operational Stability Top Contact Configuration Thermal Effects Sol-Gel Reaction Co-Solvent System Crack Propagation Dielectric Materials Driving Characteristics Electromotive Force Electrohydrodynamic Jet Printing Flexible Substrate Film Formation Gas Molecules Gas Barrier Properties Homogeneous Solution Key Element Industrial Technology K-Doped Low Surface Energy Lift-Off Mixed Zone Metal-Oxide-Metal Measuring Equipment Molecular Orientation Relative Humidity Semiconducting Layer Stability And Durability Pulsed Laser Ablation(PLA) Polar Group Printing Method Plasma-Enhanced Chemical Vapor Deposition (Pecvd) Various Substrates Two-Step Heat Treatment