ETRI-Knowledge Sharing Plaform

4h-Sic Silicon Carbide(3C-SiC) Breakdown Voltage Trench Gate Low Temperature Cofired Ceramics(LTCC) Fabrication Process High Performance Etch Rates Schottky Barrier Diode(SBD) Sic Mosfet Large Area Electrical Properties Gate Dielectric Power Semiconductor Response Characteristics Stray Inductance Dc-Dc Converters Film Thickness Multilayer Circuit Power Inductor Specific On-Resistance Gate Voltage Design And Fabrication Surge Current Field-Emission Scanning Electron Microscopy(FE-SEM) Blocking Voltage Depletion Width Through Silicon Vias(TSV) Metal-Oxide-Semiconductor Field-Effect Transistor(MOSFET) Sio 2 Spectral Range Sic Sbd Patterning Technique Low Voltage Electromagnetic Interference(EMI) High Current Power Losses Dry Etching Scanning Electron Microscope Oxidation Process Replica Mold 700 V Pin Photodiodes Process Conditions Silicon Sensors Measurement Results Bosch Process Etching Process Anode Current Chemical Mechanical Polishing(CMP) Deep Trench Capacitor Inductively Coupled Plasma(ICP) Reliability Test Silicon Detector High Resolution Radiated Emission Driving Capability Isolation Technique Self-Aligned Low Current Gas Mixtures Insulated Gate Bipolar Transistor(IGBT) Unit Cell High-Density Silicon Pixel Detector Input Power Exposure Time Applied Physics Auger Electron Spectroscopy Source Power Channel Length Uv Nanoimprint Lithography(UV-NIL) High Power Applications Sub-30 Nm Structures Electro Static Discharge(ESD) Gate Oxide Single-Sided Theoretical And Experimental Analysis Edge Termination Flow Rate Performance Analysis Patterning Technology Power Factor Correction (Pfc) Converter Imaging Device Interface Trap Density(Nit) Power Conversion System Flat-Band Voltage Reverse Leakage Current Silicon Substrate Bipolar Transistors Power Diode Near-Ir Wire Bonding Potential Distribution Insulator Layer Photo Response Double-Sided Peak Current Temperature Coefficient Of Resistance(TCR) Critical Dimension Ir Spectral Switching Characteristics Turn-On Voltage Input Voltage High Aspect Ratio Polycrystalline Silicon(poly-Si) Single Chip Thermionic Field Emission Crystal Orientation Output Current Dbc Substrate Low-Cost Process Pressure Pin Diode Reverse Recovery Charge Mach-Zehnder(MZ) X-Ray Imaging Electrical Resistance Fully Depleted(FD) Circuit Board Etch Profile High Voltage Class B Vertical Electrodes Commercial Products Merged Pin Schottky Diode Reverse Bias Human Body Model Silicon Wafer Ionizing Radiation High Efficiency Simulation Results Template Fabrication Parasitic Effects P-Doping Ag Paste High Capacity Infrared (Ir) Sensor Radiation Detector Signal-To-Noise Voltage Performance 60 Hz Infrared Sensors Load Conditions Light Emitting Diodes(LED) Laser System Organic Light Emitting Diode(OLED) Slope Angle Thin Silicon Anode And Cathode Optical Radiation Oxide Etching Sic Device Process Factors Pulse Power Cmos Devices Line Width Operating Condition Region Area Acceleration Voltage Each Region Focused Ion Beams Functional Groups Junction Termination Extension(JTE) N-Type Silicon Memory Structure 20 Nm 3 V Sic Power Devices Monolithically Integrated Recovery Current Subthreshold Characteristics Localized Trap States Switching Devices Process Complexity Aluminum Wires Electrical Devices Fast Response On-State Characteristics 3d Interconnection Model Tests Sub-50 Nm Human Teeth Transmission Line Pulse(TLP) Chemical Sensors Low Threshold Voltage Off-State Slope Control Polyurethane-Acrylate Power Block Double-Pulse Dynamic Test Hydrogen Silsesquioxane(HSQ) Process Simulation Power System Application Ag Ink Adaptively Coupled Plasma CF 4 Differential Drive Dental Radiography Experimental Design Geothermal Power Plants Ion Bombardment Interference Test Magnetic Memory Semiconductor Manufacturing 2 Mm Via Filling Tapered Via Physical Mechanism Contact Angle Measurements Experimental Study Feature Size Good Isolation Interface Characteristics Low Energy Operating Temperature Microcontact Printing(CP) Optical Networks Turn-On Characteristics S-Band Post Oxidation Triple-Gate Pattern Depth Bulk Silicon Cmos-Compatible Dynamic Load Electrode Structure Nano-Ag Optical Transmission Silicon Waveguide Step Coverage P-Type Doping Press-Pack By-Products(DBPs) Cross-Linking Density Dual Output Gas Permeability High Temperature Storage Ir Intensity Multi-Purpose Noise Mitigation Source Region Structural And Electrical Characteristics Size Reduction Surface Defects Thermal Oxidation CS 1 Deep Reactive Ion Etching Electrical Engineers Master Mold Noise Sources Organic Thin Film Transistor(OTFT) Radio-Frequency Static And Dynamic Characteristics 3.5 Ghz Process Research Additive Effect Dirac Point Voltage E-Beam Graphene Field-Effect Transistors Koh Solution Resistance Change Rate Of Rise Subthreshold Region Silicon Deep Etching Avalanche Photo Diode(APD) Conduction Loss Graphene Fets Inductance Extraction Low Loss Organic Solvents Reliability Evaluation Boron Diffusion Barrier Metal Electric Energy Junction Isolation Micro Electro Mechanical Systems (Mems) Technology Resistive Component Thermal Cycling C-V Characteristics Energy Barrier Height Full-Load Glucose Detection High Elastic Modulus Ir Detector Low Temperature Co-Fired Ceramic (Ltcc) Substrate Line Regulation Low Pressure NH 3 Re-Oxidation Rising Rate Potential Barrier Cost-Effective Extinction Ratio(ER) High-Quality Light Pulse Level Shifter Thin Wafer Technology Trends Power Limiter Release Agent Experimental Measurement Ge-On-Si Interfacial Layer Influential Factor Linear Characteristic Micro-Features Modulation Efficiency Wide Range Small Size Diffusion Temperature Environmental Concerns Load Change Nitrogen-Rich Voltage Sweep Physical Contact Pecvd Oxide Parylene Films Coupled Waveguide Direct Bonded Copper(DBC) Excess Charge Hfo 2 Gas Composition Mos Capacitor Neural Network(NN) Normal Operation Silicon Photonics Vanadium Pentoxide X-Ray Images Hvdc Transmission New Technology Numerical Simulation(Trnsys16) Series Resistance Peak Voltage Anisotropic Wet Etching Average Efficiency Charge Carriers Flow Ratio Near-Infrared Schottky Rectifier Si Etching Semiconductor Package Silicon Semiconductor Sensor Device Trench Etching Pumping Speed An Inverter Simulation Study Water Contact Angles(WCA) Test Circuit Esd Protection Etch Mechanism Pixel Readout Power Handling Capability Fabrication And Characterization Nanoscale Mosfets Rated Power Silicon Nitride Switching Frequency Pentacene Film Best Performance Conformal Deposition Cross Regulation Dielectric Stability Forward Current Interface Properties Loss Characteristics Smooth Surface Parylene-C Cathode Region Drain Current Flat Panel Lead Free Solder Alloy Multilayer Design Optical Interconnects Sin X Smart Power Ic Line-And-Space Voltage Characteristics Direct Current Resistance(DCR) Schottky Interface Plasma Etching Photonic Interconnects Potential Applications Biosensor Fabrication Electron Beam Irradiation Grating Structure Glucose Concentration Gas Plasma Intensity-Based Nano-Sized Surface Characteristics Silicon Micromachining Surface Mount Device Dc-Type Position Resolution Promotion Strategy Boron Doping Delay Time Switching Operation Constant Pressure Static And Dynamic Performances Design And Development Processes FE-AES Industrial Applications Mixing Ratio On-State Current Output Voltage Reliability Issue Semiconductor Detectors Simulation And Experiment X-Ray Photoelectron Spectroscopy (Xps) Diffusion Process Filling Properties Loading-Unloading Output Stability Power Converter Reactive Etching Critical Voltage Direct Writing Energy Ion Implantation Gas Pressure Heat Dissipation Infrared Spectrometer Low Surface Energy Low Dark Current Radical Density Vertical Profile Power Factor Correction Converter Electrode Spacing Efficiency Improvement Form Factor Microstrip Sensor N-Channel Radiation Response High Energy Physics 3-Phase Inverter Photonic Circuit CMOS IC Charge Density Manufacturing Cost Oxide-Semiconductor Field-Effect Transistors Rf Receiver Selective Etching On-Chip Simulation And Measurement Bcd Technology Cmos Process Charge Generation Current Capacity Hfo X Insertion Loss Low Forward Voltage Drop Lateral Diffusion N 2 Coulomb Scattering Photo-Curable Q Factor Bipolar-Cmos-Dmos(BCD) Drying Time High Purity O Radical Postdeposition Annealing(PDA) Rough Surface Curing Temperature Device Packaging Gas Exposure High Doping Concentration High-Temperature Applications Block Copolymer(BCP) Bubble Defects Design Method Oil And Gas Industry Pulsed Power Electronic System High Resistance Half-Bridge Power Module Multi-Scale Residual Layer Si Substrate Strip Detector Parallel Lines Phase Shifter Direct Oxidation Electric Field Distribution Grain Boundaries Solution Process Super-Junction Semiconductor Packaging Silicon-Based Extraction Method 22 Nm 2d Simulation 65 Nm Three Dimensional(3D) Photonic Integrated Circuits(PICs) Potential Gradient Design Considerations Electric Bike Low Shrinkage Minority Carrier Off-Chip Silicate Glasses Silicon On Insulator(SOI) Support Project Poly-Silicon Power Signal Breakover Diode Block Assembly Exposure Rate Hybrid Detector Metal-Insulator-Semiconductor Capacitor Surface Design Space Charge Region Temperature Humidity Bias(THB) X-Ray Microscope Critical Rate Hf-Silicate Optical Sensor Vanadium Oxide Thin Film Spacer Layer Photonic Devices P-Type Dopant Computer Vision(CV) Ceramic Substrate Light Triggered Thyristor Nuclear Energy Travelling Wave Pulse Generator Ar Plasma Cl 2 Dual Stack Filling Method Reverse Blocking Soi Wafer Vacuum Drying Equivalent Oxide Thickness High Modulus Irradiation Test Non-Doped Oxide Thin Films Reflection Loss Degradation Rate Multi-Layer Substrate High Reliability Thick Copper Uv Transparency Switching Noise Thermal Initiator Plasma Enhanced Cvd Pn Junction Diode Process Technology Reduced Pressure Chemical Vapor Deposition(RPCVD) Relativistic Heavy Ion Collider Components Technology Ion Flux Boron Implantation Charge Balance Cross-Linked Pvp Doping Process Etching Conditions High Durability Input-Output Direct Patterning Schottky Contacts Effective Dielectric Rise Rate 4-Vinylphenol(Poly) Penetration Depth Bonding Structure Battery Electric Vehicles(BEVs) Center Point Material Approach Nanoindentation Method Space Exploration Trench Isolation Protection Circuit Boron Concentration Battery Voltage Low Concentration Rapid Thermal Annealing(RTA) Sheet Resistance Sensor Concept Schottky Junction Vacuum-Assisted Analog Ic Depletion-Mode Output Ripple Trench Power Mosfets Pentacene Field-Effect Transistors Compound Semiconductor Electrical Response Ic Chip Lateral Igbt Sensor Design Switching Loss Saturation Current Capacitance-Voltage Photo-Initiator Para-Xylylene(Poly) Etch Selectivity Epitaxy Growth Forming Processes High Water Gas Fraction Rf Power Turn-Off Characteristics Uv Light Supply Voltage Power Function Remote Plasma Nitridation High Throughput Ultraviolet Nanoimprint Lithography Process And Device Simulation Chemical Etch Blocking Capability Gate Driving Circuit Low Switching Load Regulation Low Parasitic Inductance Mems-Based Wavelength Components Storage Life Snap-Back Power Rectifier High Mechanical Properties Manufacturing Processes Surface Pattern Reverse Voltage Dc Bias Voltage Annealing Process Pulse Current Process Parameters Experimental Data Electron Beam Lithography Flexible Substrate Gate Bias Medical Imaging Resistance Modulation Variable Lateral Doping Cf X Energy Conversion Lateral Dimensions Micro-Spectrometer 1200 V Cmos Integrated Circuit Mems Microphone Optical Lithography Response Time