ETRI-Knowledge Sharing Plaform

4h-Sic High Performance Fabrication Process Silicon Carbide(3C-SiC) Trench Gate Breakdown Voltage(BDV) Response Characteristics Process Conditions 700 V Gate Dielectric Power Semiconductor Dc-Dc Converters Etch Rates Large Area Schottky Barrier Diode(SBD) Measurement Results Silicon Sensors Design And Fabrication Electrical Properties(I-V curve) Stray Inductance Pin Diode High Current Multilayer Circuit Oxidation Process Through Silicon Vias(TSV) Power Inductor Pin Photodiodes Replica Mold Spectral Range Fully Depleted(FD) Ion Implantation Field Emission Scanning Electron Microscopy(FESEM) Nano-Scale Patterning Technique Silicon Substrate Low Voltage Near-Ir Sic Sbd Power Losses Depletion Width Scanning Electron Microscope Bosch Process Block Assembly Human Teeth Potential Distribution Silicon Detector High Power Applications Input Voltage Class B Edge Termination Merged Pin Schottky Diode Micro-Electro-Mechanical System(MEMS) Turn-Off Parasitic Effects Pixel Readout Vertical Electrodes Imaging Device Interface Trap Density Low-Cost Mach-Zehnder(MZ) Blocking Voltage Channel Length Double-Sided Exposure Time X-Ray Image Simulation Results High Voltage Input Power CMOS IC Dry Etching Power Diode Power Factor Correction (Pfc) Converter Ir Spectral Metal-Oxide-Semiconductor Field-Effect Transistor(MOSFET) Commercial Products Deep Trench Capacitor Etch Profile Wire Bonding Template Fabrication Surge Current Power Conversion System Reverse Leakage Current Film Thickness High-Resolution Applied Physics Etching Process Vanadium Oxide Switching Characteristics Turn-On Voltage Patterning Technology Process Pressure Sic Mosfet Sio 2 Source Power X-Ray Imaging Single-Sided Flow Rate High Aspect Ratio High-Density Ionizing Radiation(IR) Auger Electron Spectroscopy Dbc Substrate Electromagnetic Interference Self-Aligned Thermal Oxidation Photo Response Reverse Recovery Charge Reliability Test Silicon Pixel Detector Flat-Band Voltage High Efficiency Low Current Electrical Resistance N-Type Silicon Performance Analysis Theoretical And Experimental Analysis Silicon Wafer Filling Method Gas Composition Heat Dissipation Hvdc Transmission High-Purity Intrinsic Layer Isolation Technique Low Shrinkage Line Width Low Temperature Co-Fired Ceramic (Ltcc) Substrate Load Conditions Load Regulation Load Change Level Shifter Acceleration Voltage Adaptively Coupled Plasma C-V Characteristics Chemical Sensor Conformal Deposition Coulomb Scattering Current Capacity Components Technology Design And Development Processes Doping Process Etch Mechanism Electrode Structure Electron Beam Irradiation Each Region Experimental Design Etch Selectivity Nano-Sized Nitrogen-Rich Nuclear Energy On-State Characteristics Organic Solvents On-Chip Water Contact Angle Transmission Line Tapered Via Temperature Humidity Bias(THB) Trench Etching Trench Power Mosfets Power System Application Photo-Curable Photonic Devices Phase Shifter Pumping Speed Process And Device Simulation Parasitic Capacitance Pentacene Field-Effect Transistors Photo-Initiator Physical Mechanism Rapid Thermal Annealing(RTA) Radio Frequency(RF) Response Time Rated Power Solution Process Step Coverage Resistive Component Vertical Profile Uv Light Super-Junction Fast Response Forward Current Full-Load High Doping Concentration Human Body Model(HBM) High-Quality Ion Bombardment Insulator Layer Influential Factor Low Concentration Lead Free Solder Alloy Low Threshold Voltage Metal-Insulator-Semiconductor Capacitor Master Mold An Inverter Battery Electric Vehicles Curing Temperature Charge Balance Critical Dimension Ceramic Substrate Crystal Orientation Degradation Rate Direct Oxidation Dielectric Stability Dc Bias Voltage Electric Energy Electrode Spacing Epitaxy Growth Mos Devices Mems-Based Microcontact Printing(CP) Nano-Ag New Technology Optical Radiation Optical Interconnect(OI) Voltage Performance Semiconductor Manufacturing Saturation Current Temperature Coefficient Of Resistance(TCR) Dc-Type X-Ray Photoelectron Spectroscopy (Xps) Recovery Current Penetration Depth Pn Junction Diode Plasma Enhanced Cvd Pecvd Oxide Photonic Interconnects P-Type Doping P-Type Dopant Rise Time Quality-Factor(Q-factor) S-Band Subthreshold Region Sub-30 Nm Structures Schottky Junction Simulation And Measurement Focused Ion Beam Graphene Field-Effect Transistors Glucose Detection Hf-Silicate High Modulus High Elastic Modulus High Temperature Storage Junction Termination Extension(JTE) Insertion Loss Infrared (Ir) Sensor Ic Chips Inductively-Coupled Plasma(ICP) Line-And-Space Lateral Igbt Mixing Ratio Anode And Cathode Ag Ink Annealing Process Boron Implantation Breakover Diode Boron Diffusion Cost-Effective Cross-Linking Density Constant Pressure Cross Regulation Drain Current Direct Bonded Copper(DBC) Experimental Data E-Beam Energy Conversion Energy Barrier Height Electric Bike Experimental Measurements Extraction Method Numerical Simulations Output Stability Optical Loss Off-State Oxide Thin Films Oxide Etching Vanadium Pentoxide 1200 V Support Project Silicon Semiconductor Dynamic Load Thin Silicon Position Resolution Postdeposition Annealing(PDA) Process Simulation Plasma Etching Printed Circuit Board(PCB) Promotion Strategy Potential Gradient Radiation Detector Reduced Pressure Chemical Vapor Deposition Sub-50 Nm Subthreshold Characteristics Silicon Photonics Soi Wafer Silicon Waveguide Signal-To-Noise Silicate Glasses Silicon Deep Etching Size Reduction Sensor Design Graphene Fets Hydrogen Silsesquioxane Input And Output Ir Intensity Ion Flux Loss Characteristics Light Triggered Thyristor Light Pulse Multi-Purpose Average Efficiency Charge Carriers Chemical Mechanical Polishing(CMP) Differential Drive Dual Output Equivalent Oxide Thickness Driving Capability Excess Charge Etching Conditions Optical Network Optical Lithography 22 Nm Semiconductor Package 4-Vinyl Phenol(Poly) Switching Loss Storage Life Surface Mount Device Static And Dynamic Performances Thermal Cycling 65 Nm Thermal Initiator Thin Wafer Trench Isolation X-Ray Microscope Polyurethane-Acrylate Process Parameters Process Factors Process Complexity Parallel Lines Post Oxidation Rf Power Resistance Change Structural And Electrical Characteristics Unit Cell Vacuum-Assisted UV-NIL Space Charges Space Charge Region Filling Properties Forming Processes Fabrication And Characterization Grain Boundaries Gate Voltage Gate Bias Grating Structure High Durability High Throughput(HTP) Half-Bridge Power Module High Resistivity High Energy Physics Infrared Spectrometer Interface Characteristics Interfacial Layer Low Electric Field Line Regulation Monolithically Integrated Aluminum Wires Ag Paste Bonding Structure Coupled Waveguide Complementary Metal-Oxide-Semiconductor(CMOS) Drying Time Direct Writing Design Considerations Dental Radiography Electrical Response Electric Field Distribution Multi-Layer Substrate Micro-Spectrometer Near-Infrared(NIR) Oxide-Semiconductor Field-Effect Transistors Output Current Output Ripple Wire-Bonded Simulation And Experiment Thick Copper 20 Nm Critical Voltage 3d Interconnection 3-Phase Inverter Switching Operation Photonic Integrated Circuits(PICs) Process Research Power Limiter Parylene-C Power Rectifier Power Factor Correction Converter Reflection Loss Release Agent Voltage Sweep Vacuum Drying Simulation Study Schottky Contacts Silicon Micromachining FE-AES High Mechanical Properties Ir Detector Low Parasitic Inductance Low Dark Current Low Pressure Linear Characteristic Microstrip Sensor Material Approach Micro-Features Minority Carrier Avalanche Photo Diode(APD) Ar Plasma Bubble Defects Block Copolymer Boron Doping Cmos-Compatible Cl 2 Chemical Etch Conduction Loss Capacitance-Voltage Cathode Region Dirac Point Voltage Compound Semiconductor Diffusion Process Drift Velocity Diffusion Temperature Direct Current Resistance(DCR) NH 3 Non-Doped Wavelength Components Snap-Back Travelling Wave Switching Frequency Thermionic-Field Emission Potential Applications Poly-Silicon Power Signal Power Handling Capability P-Doping Peak Current Reverse Bias Radiated Emission Reactive Etching Relativistic Heavy Ion Collider Sheet Resistance Reverse Voltage Slope Control Smooth Surface Schottky Rectifiers Smart Power Ic Specific On-Resistance Surface Defects Semiconductor Integrated Surface Characteristics Form Factor Glucose Concentration Gas Plasma High Reliability Infrared Sensor Intensity-Based Localized Trap States Low Energy Koh Solution Low Forward Voltage Drop Lateral Dimensions Multi-Scale Anisotropic Wet Etching Bcd Technology By-Products Boron Concentration Blocking Capability Computer Vision(CV) Critical Rate Dynamic Test Electro-Static Discharge(ESD) Double-Pulse Extinction Ratio Manufacturing Cost N-Channel Neural Network N 2 Mems Microphone Noise Mitigation Operating Conditions Off-Chip Optical Transmission Wide Range Small Size Semiconductor Packaging 2 Mm Efficiency Improvement Switching Device Gas Pressure Triple-Gate Photonic Circuits Pentacene Film Potential Barrier Pulsed Power Power Converter Pulse Power Radiation Response Remote Plasma Nitridation Surface Design Silicon Nitride Region Area Slope Angle Re-Oxidation Rf Receiver Ultraviolet Nanoimprint Lithography Static And Dynamic Characteristics Semiconductor Detectors Sensor Concept Sic Power Devices Sic Device Flow Ratio Gas Mixture Gas Exposure Gas Permeability Ge-On-Si Good Isolation Hfo 2 Hfo X High-Capacity High Resistance High Water Interference Test Inductance Extraction Interface Properties Ir Filter Low Surface Energy Loading-Unloading Lateral Diffusion Low Switching Low Loss Medical Imaging Modulation Efficiency Manufacturing Processes Additive Effect Charge Generation Center Point Cross-Linked Pvp Charge Density Deep Reactive Ion Etching Dual Stack Device Packaging Electrical Engineers Effective Dielectric Mos Capacitor Nanoindentation Method Output Voltage On-State Current Organic Thin-Film Transistors Supply Voltage 2d Simulation 3.5 Ghz Physical Contact Polycrystalline Silicon(poly-Si) Pulse Generator Rough Surfaces Reverse Blocking Surface Pattern Switching Noise Rate Of Rise Via Filling Uv Transparency Single-Chip Source Region Si Substrate Si Etching Schottky Interface