ETRI-Knowledge Sharing Plaform

4h-Sic Silicon Carbide(3C-SiC) High Performance Fabrication Process Trench Gate Breakdown Voltage(BDV) Etch Rates Schottky Barrier Diode(SBD) Electrical Properties(I-V curve) Stray Inductance Gate Dielectric Power Semiconductor Dc-Dc Converters Response Characteristics Large Area Bosch Process Design And Fabrication Process Conditions Measurement Results 700 V Surge Current Metal-Oxide-Semiconductor Field-Effect Transistor(MOSFET) Multilayer Circuit Film Thickness High Current Sio 2 Power Inductor Oxidation Process Through Silicon Vias(TSV) Electromagnetic Interference Replica Mold Pin Photodiodes Spectral Range Gate Voltage Ion Implantation Specific On-Resistance Field Emission Scanning Electron Microscopy(FESEM) Patterning Technique Power Losses Low Voltage Sic Sbd Blocking Voltage Depletion Width Scanning Electron Microscope Silicon Sensors Dry Etching Self-Aligned Electrical Resistance Flat-Band Voltage Fully Depleted(FD) High Efficiency Performance Analysis Silicon Wafer Low Current Output Current Theoretical And Experimental Analysis Anode Current Silicon Detector Gate Oxide Reverse Bias Potential Distribution Peak Current Radiated Emission Silicon Substrate Class B Edge Termination High Power Applications Input Voltage Parasitic Effects Single Chip Merged Pin Schottky Diode Near-Ir Vertical Electrodes Channel Length Double-Sided Exposure Time Gas Mixture Interface Trap Density Imaging Device Polycrystalline Silicon(poly-Si) Low-Cost Simulation Results Mach-Zehnder(MZ) Power Diode Electro Static Discharge(ESD) High Voltage Input Power Isolation Technique Power Factor Correction (Pfc) Converter Wire Bonding Critical Dimension Crystal Orientation Commercial Products Deep Trench Capacitor Sub-30 Nm Structures Human Body Model(HBM) Etch Profile Insulator Layer Ir Spectral Reverse Leakage Current Pin Diode Power Conversion System Template Fabrication Temperature Coefficient Of Resistance(TCR) X-Ray Imaging Applied Physics Turn-On Voltage Etching Process High-Resolution Inductively-Coupled Plasma(ICP) Patterning Technology Process Pressure Source Power Sic Mosfet Single-Sided Switching Characteristics Thermionic Field Emission Auger Electron Spectroscopy Chemical Mechanical Polishing(CMP) Circuit Board UV-NIL Unit Cell Dbc Substrate Driving Capability Flow Rate High Aspect Ratio Ionizing Radiation(IR) High-Density Photo Response Reliability Test Reverse Recovery Charge Silicon Pixel Detector Adaptively Coupled Plasma Acceleration Voltage Bipolar Transistors Conformal Deposition Coulomb Scattering C-V Characteristics CMOS IC Current Capacity Cmos Integrated Circuit CS 1 Components Technology Doping Process Level Shifter Rated Power Design And Development Processes 60 Hz Organic Solvents Etch Mechanism Electrode Structure Electron Beam Irradiation Electronic Systems Experimental Design Etch Selectivity Each Region Filling Method Gas Composition Heat Dissipation High-Purity Hvdc Transmission Industrial Applications Trench Power Mosfets Response Time Photo-Curable Photonic Devices Phase Shifter Pumping Speed Power System Application Process And Device Simulation Pentacene Field-Effect Transistors Physical Mechanism Press-Pack Photo-Initiator Rapid Thermal Annealing(RTA) Radical Density Low Shrinkage Line Width Resistive Component Solution Process Step Coverage Radio Frequency(RF) Super-Junction Low Temperature Co-Fired Ceramic (Ltcc) Substrate Load Conditions Load Regulation Load Change Magnetic Memory Nano-Sized Nitrogen-Rich Nuclear Energy On-State Characteristics Oil And Gas Industry On-Chip Trench Etching Tapered Via Temperature Humidity Bias(THB) Turn-On Characteristics Test Circuit Uv Light Vertical Profile Water Contact Angle X-Ray Photoelectron Spectroscopy (Xps) An Inverter Battery Electric Vehicles Barrier Metal Charge Balance Cf X Ceramic Substrate Dc Bias Voltage Lead Free Solder Alloy Penetration Depth Dc-Type Direct Oxidation Dielectric Stability Voltage Performance Degradation Rate Depletion-Mode Electric Energy Electrode Spacing Epitaxy Growth Fast Response Forward Current Full-Load Flat Panel High Doping Concentration High-Quality Influential Factor Ion Bombardment Curing Temperature Quality-Factor(Q-factor) Recovery Current Plasma Enhanced Cvd Pecvd Oxide Photonic Interconnects Pn Junction Diode P-Type Doping P-Type Dopant Low Concentration Subthreshold Region Schottky Junction Simulation And Measurement Low Threshold Voltage Master Mold Metal-Insulator-Semiconductor Capacitor Mems-Based Microcontact Printing(CP) Nano-Ag New Technologies Optical Radiation Optical Interconnect(OI) Series Resistance Semiconductor Manufacturing Saturation Current S-Band Ag Ink Annealing Process Anode And Cathode Boron Diffusion Cost-Effective Cross-Linking Density Constant Pressure Boron Implantation Breakover Diode Cross Regulation Cmos Devices Drain Current Signal-To-Noise Off-State 1200 V Direct Bonded Copper(DBC) Dynamic Load Experimental Data Energy Conversion Energy Barrier Height Exposure Rate Electric Bike Experimental Measurements Junction Termination Extension(JTE) E-Beam Focused Ion Beam Extraction Method Graphene Field-Effect Transistors High Modulus Glucose Detection High Elastic Modulus Hf-Silicate High Temperature Storage Optical Sensor Insertion Loss Infrared (Ir) Sensor Three Dimensional(3D) Reduced Pressure Chemical Vapor Deposition Radiation Detector Plasma Etching Photonic Circuit Postdeposition Annealing(PDA) Position Resolution Process Simulation Potential Gradient Line-And-Space Promotion Strategy Sub-50 Nm Subthreshold Characteristics Silicon Photonics Soi Wafer Silicon Waveguide Size Reduction Silicate Glasses Silicon Deep Etching Strip Detector Spacer Layer Sensor Design Lateral Igbt Mixing Ratio Numerical Simulations Oxide Thin Films Oxide Etching Output Stability Operating Temperature Silicon Semiconductor Thin Silicon Support Project Vanadium Pentoxide X-Ray Microscope Average Efficiency Charge Carriers Differential Drive 4-Vinyl Phenol(Poly) Silicon-Based Excess Charge Dual Output Etching Conditions Equivalent Oxide Thickness Graphene Fets Hydrogen Silsesquioxane Hybrid Detector Ion Flux High-Temperature Applications Organic Light-Emitting Diodes(OLEDS) Input And Output Ir Intensity Sensor Device Rf Power Resistance Modulation Polyurethane-Acrylate Power Function Process Parameters Process Factors Process Complexity Parallel Lines Post Oxidation Peak Voltage Resistance Change Structural And Electrical Characteristics Space Charge Region Light Triggered Thyristor Light Pulse Loss Characteristics Multi-Purpose Memory Structure 22 Nm O Radical Optical Network Optical Lithography Switching Loss Storage Life Surface Mount Device Static And Dynamic Performances Space Exploration Semiconductor Package Trench Isolation Thermal Initiator Thermal Cycling Thin Wafer Thermal Oxidation Vacuum-Assisted 65 Nm Ag Paste Analog Ic Aluminum Wires Coupled Waveguide Bonding Structure Critical Voltage Drying Time Design Considerations Direct Writing Direct Patterning Dental Radiography Process Research Photonic Integrated Circuits(PICs) Output Ripple 3d Interconnection 3-Phase Inverter Electrical Response Electric Field Distribution Filling Properties Environmental Concerns Forming Processes Functional Group Grain Boundaries Gate Bias Fabrication And Characterization Grating Structure High Durability High Throughput(HTP) Gas Fraction High Energy Physics Geothermal Power Plants Gate Driving Circuit Ic Chip Interfacial Layer Half-Bridge Power Module Interface Characteristics Irradiation Test Infrared Spectrometer Simulation Study Sin X Release Agent Power Block Power Limiter Power Rectifier Power Factor Correction Converter Pulse Current Parylene-C Switching Operation Reflection Loss Silicon Micromachining Schottky Contacts Line Regulation Monolithically Integrated Micro-Spectrometer Multi-Layer Substrate Model Tests 20 Nm Near-Infrared(NIR) N-Type Silicon Oxide-Semiconductor Field-Effect Transistors Simulation And Experiment Turn-Off Characteristics Thick Copper Voltage Sweep Vacuum Drying Variable Lateral Doping Vanadium Oxide Thin Film Ar Plasma Avalanche Photo Diode(APD) Boron Doping Best Performance Bubble Defects Block Copolymer Block Assembly Cmos-Compatible Cl 2 Chemical Etch Capacitance-Voltage Cathode Region Conduction Loss Dirac Point Voltage Compound Semiconductor Diffusion Temperature Potential Applications Noise Sources Diffusion Process Direct Current Resistance(DCR) Esd Protection Electron Beam Lithography FE-AES High Mechanical Properties Human Teeth Intensity Based Ir Detector Selective Etching Reactive Etching Relativistic Heavy Ion Collider Poly-Silicon Protection Circuit Power Signal P-Doping Power Handling Capability Process Technology Parylene Films Low Dark Current Low Pressure Reliability Evaluation Reverse Voltage Sheet Resistance Slope Control Smooth Surface Schottky Rectifiers Smart Power Ic Surface Defects Surface Characteristics Linear Characteristic Low Parasitic Inductance Micro-Features Minority Carrier Material Approach Microstrip Sensor Non-Doped Nanoscale Mosfets NH 3 Switching Frequency Silicon On Insulator(SOI) Snap-Back Travelling Wave Transmission Line Pulse(TLP) Wavelength Components Biosensor Fabrication Anisotropic Wet Etching Boron Concentration By-Products Bcd Technology Blocking Capability Computer Vision(CV) Bulk Silicon Dynamic Test Extinction Ratio Design Method Delay Time Double-Pulse Efficiency Improvement Form Factor Gas Pressure Glucose Concentration Gas Plasma High Reliability Infrared Sensor Koh Solution Critical Rate Triple-Gate Remote Plasma Nitridation Residual Layer Radiation Response Reliability Issue Pattern Depth Pentacene Film Potential Barrier Pixel Readout Pulsed Power Power Converter Para-Xylylene(Poly) Pulse Power Low Forward Voltage Drop Localized Trap States Region Area Re-Oxidation Low Energy Rising Rate Silicon Nitride Rise Rate Rf Receiver Surface Design Slope Angle Static And Dynamic Characteristics Sic Power Devices Sic Device Semiconductor Detectors Sensor Concept Lateral Dimensions Multi-Scale Manufacturing Cost Mems Microphone 2 Mm Noise Mitigation N-Channel N 2 Neural Network Operating Conditions Off-Chip Optical Transmission Switching Device Semiconductor Packaging Small Size Ultraviolet Nanoimprint Lithography Wide Range X-Ray Image Additive Effect Bipolar-Cmos-Dmos(BCD) Chemical Sensors Charge Density Center Point Charge Generation Cross-Linked Pvp CF 4 Contact Angle Measurements Deep Reactive Ion Etching Junction Isolation Si Substrate 3.5 Ghz Nanoindentation Method 3 V Dual Stack Device Packaging Electrical Engineers Effective Dielectric Flow Ratio Electrical Devices Flexible Substrate Feature Size Gas Exposure Gas Permeability Ge-On-Si Good Isolation High Resistance High-Capacity Hfo 2 Hfo X Interface Properties Insulated Gate Bipolar Transistor Interference Test Inductance Extraction Cmos Process Rough Surfaces Reverse Blocking Physical Contact Pulse Generator Low Surface Energy Loading-Unloading Laser System Rate Of Rise Surface Pattern Source Region Si Etching Schottky Interface Low Switching Low Loss Lateral Diffusion Modulation Efficiency Manufacturing Processes Medical Imaging Micro Electro Mechanical Systems (Mems) Technology Mos Capacitor Multilayer Design On-State Current Output Voltage 2d Simulation Organic Thin-Film Transistors Switching Noise Supply Voltage Technology Trends Uv Transparency Via Filling High Water