ETRI-Knowledge Sharing Plaform

Schottky Barrier Diode(SBD) Power Semiconductor Dc-Dc Converters Forward Current Multilayer Circuit Silicon Carbide(3C-SiC) Algan/Gan-On-Si Reverse Recovery Charge Power Inductor Power Conversion System Power Losses Input Voltage Electrical Characteristics Breakdown Voltage(BDV) High Electron Mobility Transistor(HEMT) Dry Etch Channel Width Normally-Off Stray Inductance 700 V Sic Sbd Dynamic Characteristics Load Conditions Load Regulation Load Change Power Factor Correction (Pfc) Converter Temperature Humidity Bias(THB) Wheel Motor Full-Load Commercial Products Reverse Leakage Current Dynamic Load Electric Bike High Temperature Storage High Current Output Power Switching Characteristics Trade-Off Forward And Reverse Dbc Substrate Electromagnetic Interference Switching Loss Storage Life Semiconductor Package Electrical Resistance Gate Bias Line Regulation Low Current High Thermal Conductivity Multi-Layer Substrate Theoretical And Experimental Analysis Performance Analysis Algan/Gan Hfet Boost Converter Control Scheme High Power Conversion Efficiency Low Parasitic Inductance Reverse Voltage Efficiency Improvement Low Voltage Class B Power Electronics Permanent-Magnet(PM) Structural Changes Turn-Off Parasitic Effects Low Switching Low Turn-On Voltage Conversion Systems Supply Voltage Temperature Test High Power Density Inductance Extraction Low Loss Lift-Off Process Interference Test Motor System Motor Dynamics 48 V Output Voltage Pulse Generator Reliability Testing System Architecture 16 Nm Switching Conditions Switching Noise 3 V 3.5 Ghz Power Factor Correction Converter Anode Structure Conduction Loss Device Size Direct Current Resistance(DCR) Mesa Etching Drain Leakage Current Peak Current Physical Model Process Technology Power Signal Non-Doped Reverse Recovery Time Radiated Emission Small Form Factor Single-Input Reverse Bias Silicon Substrate Snap-Back Virtual Shaft Buck Converter Current Collapse Control Lines Dynamic Test Electro-Static Discharge(ESD) Gate Recess High Switching Frequency High Reliability Inverter Topology Lateral Dimensions Air-Core Double-Pulse Switching Device Pulse Power Noise Mitigation Power Converter Rf Receiver Si-Based Switching Power Soft Switching Stabilization Time Storage Temperature Small Size 2 Mm Topology Design Theoretical Analysis Zero-Voltage Switching Semiconductor Packaging Blocking Voltage Back Electromotive Force Channel Length Drain Voltage Dual Stack Device Packaging Enhancement-Mode Electrical Engineers Electric Vehicle(EV) Extraction Method Electrical Energy High-Power Applications Insertion Loss 1200 V Printed Circuit Board(PCB) Output Stability Numerical Simulations Rotational Symmetry Reverse Current Smd Package Synchronous Buck Sic Mosfet Thermal Vias Average Efficiency Design And Analysis Driving Capability Dual Output Converter Heat Transfer Input And Output Loss Characteristics Metal-Insulator-Semiconductor(MIS) Hard Switching High-Density Metal Layer Magnetic Dipole Surface Mount Device Self-Aligned Thermal Oxidation Torque Analysis Static And Dynamic Performances Thermal Cycling Fluorine Ions Attitude Error As 2 Al Film Aluminum Wires Bonding Structure Dynamic Ron Half-Bridge Power Module Hemispherical Shell Large-Scale Embedded Cavity Mechanical Operation Mobile Application(APP) Oxide-Semiconductor Field-Effect Transistors Output Ripple Power Limiter Power Device Reflection Loss Surface Passivation Signal Line Self-Heating Simulation And Experiment Thick Copper Design Evaluation Gan Mis-Hemt Electrical Properties(I-V curve) High-Efficiency Converter Heat Dissipation Rate High Voltage Input Power Low Temperature Co-Fired Ceramic (Ltcc) Substrate Low Leakage Current Level Shifter MOS-HEMT Rated Power Radio Frequency(RF) Surface Acting Transmission Line True-Time Delay Working Temperature On-State Characteristics Off-State Stress Resistive Component Battery Voltage Ceramic Substrate Depletion Mode Design And Control Gan On Sic Gate Fabrication Gate Leakage High Performance Gan Hfets Human Body Model(HBM) In-Situ Degradation Rate Explicit Methods Lead Free Solder Alloy Low Threshold Voltage Metal-Oxide-Semiconductor Field-Effect Transistor(MOSFET) Voltage Performance On-Resistance Plasma Treatment New Type Pin Diode Recessed Gate Quality-Factor(Q-factor) S-Band Saturation Current Wire Bonding Forward Voltage Brushless Dc (Bldc) Motor Anode And Cathode Cascode Gan Fet Ceramic Layers Circumferential Air Cost-Effective Cross Regulation Drain Current Direct Bonded Copper(DBC) Etching Process