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Journal Article Thermal Characteristics of a Laser Diode Integrated on a Silica-Terraced PLC Platform
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Authors
Duk Jun Kim, Young Tak Han, Yoon Jung Park, Sang Ho Park, Jang Uk Shin, Hee Kyung Sung
Issue Date
2005-06
Citation
ETRI Journal, v.27, no.3, pp.337-340
ISSN
1225-6463
Publisher
한국전자통신연구원 (ETRI)
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.4218/etrij.05.0205.0005
Abstract
A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit (PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.
KSP Keywords
Current characteristics, Fabry-Perot laser diode(FP-LD), Flip-chip(FC), Heat dissipation, More or less, Planar lightwave circuit(PLC), Polymer resin, Thermal Characteristics, Thermal barrier, light-current