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Journal Article A New Strained-Si Channel High Voltage MOSFET for High Performance Power Applications
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Authors
Young Kyun Cho, Tae Moon Roh, Jong Dae Kim
Issue Date
2006-04
Citation
ETRI Journal, v.28, no.2, pp.253-256
ISSN
1225-6463
Publisher
한국전자통신연구원 (ETRI)
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.4218/etrij.06.0205.0067
Abstract
We propose a novel power metal oxide semiconductor field effect transistor (MOSFET) employing a strained-Si channel structure to improve the current drivability and on-resistance characteristic of the high-voltage MOSFET. A 20 nm thick strained-Si law field channel NMOSFET with a 0.75 fan thick Si 0.8Ge0.2 buffer layer improved the drive current by 20% with a 25% reduction in on-resistance compared with a conventional Si channel high-voltage NMOSFET, while suppressing the breakdown voltage and subthreshold slope characteristic degradation by 6% and 8% respectively. Also, the strained-Si high-voltage NMOSFET improved the transconductance by 28% and 52% at the linear and saturation regimes.
KSP Keywords
20 nm, Breakdown Voltage, Channel structure, Drive Current, Field Effect Transistor(FET), High performance, Metal-oxide(MOX), Metal-oxide-semiconductor field-effect transistor(MOSFET), On-resistance, Power applications, Resistance characteristic