BROWSE
Detail
Journal Article
Switching and Heat-Dissipation Performance Analysis of an LTCC-Based Leadless Surface Mount Package
- Authors
- Dong-Yun Jung, Hyun-Gyu Jang, Jong-Il Won, Doo-Hyung Cho, Sung-Kyu Kwon, Seong-Hyun Lee, Kun-Sik Park, Jong-Won Lim, Yong-Ha Lee
- Issue Date
- 2022-02
- Citation
- Journal of Semiconductor Technology and Science, v.22, no.1, pp.1-9
- ISSN
- 1598-1657
- Publisher
- 대한전자공학회 (IEIE)
- Language
- English
- Type
- Journal Article
- Abstract
- ?볾 leadless surface mount package was developed to enhance the switching and heat-dissipation properties of a power semiconductor. The package was implemented through a low-temperature co-fired ceramic (LTCC)-based multilayer circuit substrate that could form embedded cavities. A silicon carbide (SiC) Schottky barrier diode (SBD) bare die was attached to the cavity in the LTCC substrate. Chip interconnection was realized using a wide and thick copper (Cu) clip with a low parasitic inductance and electrical resistance compared to those of a conventional wire. Silver-filled multiple vias and wide metal planes were used to reduce the electrical parasitic effects and enhance the heat-dissipation of the package. The DC and dynamic characteristics of the 600 V/10 A-class SiC SBD package involving the proposed technologies were evaluated. The dynamic test results indicated that the reverse recovery charge (Qrr) was 18.7% lower than that of a traditional TO-220 packaged product with the same bare die. Furthermore, two leadless commercial products and the proposed package prototype were applied to a power factor correction (PFC) converter, and the power loss and heat-dissipation performances were compared. The proposed package exhibited a lower loss and higher heat dissipation than those of the commercial products.
This work is distributed under the term of Creative Commons License (CCL)
(CC BY NC)
(CC BY NC)
