Journal
|
2022 |
Interpolating the Directional Room Impulse Response for Dynamic Spatial Audio Reproduction
Jiahong Zhao Applied Sciences, v.12, no.4, pp.1-24 |
17 |
원문
|
Conference
|
2022 |
A Logarithmic Domain Algorithm of the Hodgkin-Huxley Neuron Model for Hardware Implementations
Insan Jeon
International Conference on Electronics, Information and Communication (ICEIC) 2022, pp.366-368 |
|
|
Journal
|
2022 |
Real-time Precise Object Segmentation Using a Pixel-wise Coarse-fine Method with Deep Learning for Automated Manufacturing
Jaemin Cho
Journal of Manufacturing Systems, v.62, pp.114-123 |
18 |
원문
|
Journal
|
2022 |
A New Perspective on Enriching Augmented Reality Experiences: Interacting with the Real World
Byung-Kuk Seo
Presence : Virtual and Augmented Reality, v.28, pp.53-63 |
3 |
|
Journal
|
2022 |
IEC CISPR SC H(무선서비스 보호를 위한 허용기준) 2021년 표준 회의
권종화
ICT Standard Weekly, v.1067, pp.1-9 |
|
|
Conference
|
2022 |
Survey of Warning Symbol Standardization for Advanced 5G Cell Broadcast Service
Doyi Kim
International Joint Conference on Convergence (IJCC) 2022 (AACL 19), v.19, pp.43-45 |
|
|
Conference
|
2022 |
RF 송수신기 보호용 고전압 PIN Limiter 다이오드
원종일
한국반도체 학술대회 (KCS) 2022, pp.1-1 |
|
|
Journal
|
2022 |
A Motion Similarity Measurement Method of Two Mobile Devices for Safety Hook Fastening State Recognition
Kyu-Seob Song IEEE Access, v.10, pp.8804-8815 |
6 |
원문
|
Journal
|
2022 |
Dual-Band Direct Conversion Receiver With Additive Mixing Architecture
Seong-Mo Moon
IEEE Access, v.10, pp.15436-15442 |
2 |
원문
|
Conference
|
2021 |
Effect of Sintering Process on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on Power Electronics Substrate
Kirak Son
International Symposium on Microelectronics and Packaging (ISMP) 2021, pp.1-1 |
|
|