Subjects : Screen printing process
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2015 | Interconnection Technology Based on InSn Solder for Flexible Display Applications Choi Kwang-Seong ETRI Journal, v.37, no.2, pp.387-394 | 14 | 원문 |
| Conference | 2014 | Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 | 8 | 원문 |
| Journal | 2013 | Fine‐Pitch Solder on Pad Process for Microbump Interconnection Bae Hyun-Cheol ETRI Journal, v.35, no.6, pp.1152-1155 | 25 | 원문 |
| Conference | 2013 | Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers Choi Kwang-Seong International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 | 0 |
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| Type | Year | Research Project | Primary Investigator | Download |
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