Subjects :
Reflow process
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
|
Conference
|
2022 |
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 |
7 |
원문
|
|
Conference
|
2019 |
Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 |
0 |
원문
|
|
Conference
|
2012 |
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 |
2 |
원문
|
|
Journal
|
2012 |
Novel Bumping and Underfill Technologies for 3D IC integration
성기준 ETRI Journal, v.34, no.5, pp.706-712 |
31 |
원문
|
|
Conference
|
2011 |
Bumping and Stacking Processes for 3D IC using Fluxfree Polymer
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 |
3 |
원문
|
|
Journal
|
2010 |
Fabrication of Micro-Lens Arrays with Moth-Eye Antireflective Nanostructures using Thermal Imprinting Process
Oh Sang Soon Microelectronic Engineering, v.87, no.11, pp.2328-2331 |
67 |
원문
|
특허 검색결과
| Status |
Year |
Patent Name |
Country |
Family Pat. |
KIPRIS |
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연구보고서 검색결과
| Type |
Year |
Research Project |
Primary Investigator |
Download |
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