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Conference
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2024 |
KoMaP: A Material Data Platform for Accelerating AI based Material Development
Choi Kang Il International Conference on Information and Communication Technology Convergence (ICTC) 2024, pp.410-411 |
0 |
원문
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Journal
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2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 |
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원문
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Journal
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2018 |
Next-Generation Neuromorphic Hardware Technology
Moon Seungeon 전자통신동향분석, v.33, no.6, pp.58-68 |
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원문
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Conference
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2011 |
Augmented Reality-Based Role-Playing Contents for Education
Sukhyun Lim International Conference on IT Convergence and Security (ICITCS) 2011 (LNEE 120), v.120, pp.337-344 |
1 |
원문
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Conference
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2011 |
An Immersive Authoring Tool for Augmented Reality-Based E-Learning Applications
Jee Hyung-Keun International Conference on Information Science and Applications (ICISA) 2011, pp.1-5 |
10 |
원문
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