Subject

Subjects : thermal cycle

  • Articles (4)
  • Patents (1)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Conference 2021 Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material   Donghwan Kim  Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 5 원문
Journal 2021 Monolithic Growth of GaAs Laser Diodes on Si(001) by Optimal AlAs Nucleation with Thermal Cycle Annealing   Young-Ho Ko  Optical Materials Express, v.11, no.3, pp.943-951 9 원문
Journal 2020 High quality GaAs epitaxially grown on Si(001) substrate through AlAs nucleation and thermal cycle annealing   Young-Ho Ko  Solid-State Electronics, v.166, pp.1-5 5 원문
Journal 2008 Stress Reduction of Ge<SUB>2</SUB>Sb<SUB>2</SUB>Te<SUB>5</SUB> by Inhibiting Oxygen Diffusion   Park Young Sam  Materials Transactions, v.49, no.9, pp.2107-2111 1 원문
특허 검색결과
Status Year Patent Name Country Family Pat. KIPRIS
Registered 2007 응력 완화층을 포함하는 광 모듈 KOREA KIPRIS
연구보고서 검색결과
Type Year Research Project Primary Investigator Download
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