Subjects : thermosetting resin
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2022 | Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF) Jiho Joo Electronic Components and Technology Conference (ECTC) 2022, pp.619-624 | 2 | 원문 |
| Conference | 2020 | Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 | 13 | 원문 |
| Conference | 2017 | Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2020 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | UNITED STATES | ||
| Registered | 2020 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | UNITED STATES |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
| No search results. | ||||