Subjects : thermal compression
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2023 | Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 | 0 | 원문 |
| Conference | 2019 | Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 | 24 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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