Subjects :
Cleaning process
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
|
Conference
|
2024 |
A Turbidity Inspection Method to Enhance the Efficiency of the Post-Processing Cleaning Process in Additive Manufacturing Environments
Kang Hyun Chul International Conference on Information and Communication Technology Convergence (ICTC) 2024, pp.1391-1392 |
0 |
원문
|
|
Conference
|
2024 |
Study on Improving Quality of Fingerprint Database Based on Multiple BSSID Information
Lee Yang Koo International Conference on Information and Communication Technology Convergence (ICTC) 2024, pp.1725-1726 |
0 |
원문
|
|
Conference
|
2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
13 |
원문
|
|
Conference
|
2017 |
Backside Via Process with Defect Free Sidewalls for GaN MMIC Applications
Kyu Jun Cho International Conference on Compound Semiconductor Manufacturing Technology (CS MANTECH) 2017, pp.1-3 |
0 |
|
|
Journal
|
2013 |
Fine‐Pitch Solder on Pad Process for Microbump Interconnection
Bae Hyun-Cheol ETRI Journal, v.35, no.6, pp.1152-1155 |
25 |
원문
|
|
Journal
|
2011 |
Novel Bumping Material for Solder-on-Pad Technology
Choi Kwang-Seong ETRI Journal, v.33, no.4, pp.637-640 |
32 |
원문
|
|
Journal
|
2005 |
Surface-Treatment Effects on Organic Thin-Film Transistors
Lim Sang Chul Synthetic Metals, v.148, no.1, pp.75-79 |
212 |
원문
|
특허 검색결과
| Status |
Year |
Patent Name |
Country |
Family Pat. |
KIPRIS |
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연구보고서 검색결과
| Type |
Year |
Research Project |
Primary Investigator |
Download |
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