Subjects : De-embedded
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2016 | Characterization of Transmission Lines with Through-silicon-vias and Bump Joints on High-resistivity Si Interposers for RF Three-dimensional Modules Choi Kwang-Seong Japanese Journal of Applied Physics, v.55, no.6S3, pp.1-5 | 2 | 원문 |
| Conference | 2011 | 60% High-Efficiency 3G LTE Power Amplifier with Three-Level Delta Sigma Modulation Assisted By Dual Supply Injection Kim Joon Hyung International Microwave Symposium (IMS) 2011, pp.1-4 | 21 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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