Subjects : silicon interposer
| Type | Year | Title | Cited | Download |
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| Conference | 2025 | Heterogeneous Integration through 2.5D Silicon Interposers for Next-Generation AI and HPC Applications 김덕기 International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-1 | ||
| Conference | 2024 | Silicon interposer vs. liquid crystal polymer interposer for heterogeneous integration of 0.8Tbps SiPh optical chiplet Lee Jyung Chan 한국광학회 학술 발표회 (동계) 2024, pp.1-1 | ||
| Conference | 2023 | A design and analysis of high-speed signal path in chip-on-silicon interposer enabling a 0.8Tbps SiPh chiplet Lee Jyung Chan Optics and Photonics Congress 2023, pp.1-1 | ||
| Conference | 2020 | A Compact Optics Embedded Optical Receiver Engine Mounted on Silicon Interposer for 400G CWDM4 10km Data Center Application Lee Jyung Chan Asia Communications and Photonics Conference (ACP) 2020, pp.1-3 | ||
| Conference | 2014 | Power Noise Isolation in a Silicon Interposer with Through Silicon Vias Myunghoi Kim Electronics Packaging Technology Conference (EPTC) 2014, pp.805-808 | 0 | 원문 |
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