Subjects : Ceramic Substrate
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2020 | Multi-layer Ceramic based Surface Mount Device Packaging for 1200 V and 1700 V SiC SBD Power Semiconductors Jung Dong Yun International Conference on Consumer Electronics (ICCE) 2020 : Asia, pp.603-606 | 4 | 원문 |
| Journal | 2016 | Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate Bae Hyun-Cheol Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 | 2 | 원문 |
| Journal | 2010 | 40 GHz Vertical Transition with a Dual-Mode Cavity for a Low-Temperature Co-fired Ceramic Transceiver Module Byun Woo Jin ETRI Journal, v.32, no.2, pp.195-203 | 31 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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