Subjects : Board-to-board
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2015 | A Novel Packaging Method of Fully Passive Optical Alignment for Multi-Chennel Optical Interconnection Module Lim Kwon-Seob Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2015, pp.156-158 | 0 | 원문 |
| Conference | 2011 | Board-to-board Optical Interconnection using a Flexible Hybrid Plasmonic Waveguide Jin Tae Kim International Conference on Surface Plasmon Photonics (SPP) 2011, pp.1-1 | ||
| Journal | 2006 | Demonstration of high-speed transmission through waveguide-embedded optical backplane Ahn Seung Ho Optical Engineering, v.45, no.8, pp.1-34 | 9 | 원문 |
| Conference | 2005 | Fully Active Optical Backplane System Cho In Kui European Conference on Optical Communication (ECOC) 2005, pp.535-536 | 0 | 원문 |
| Journal | 2004 | Optical backplane system using waveguide-embedded PCBs and optical slots Yoon Keun Byoung IEEE/OSA Journal of Lightwave Technology, v.22, no.9, pp.2119-2127 | 55 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
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| Type | Year | Research Project | Primary Investigator | Download |
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