Subject

Subjects : Thermal boundary

  • Articles (2)
  • Patents (0)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Journal 2023 Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging   강수민  ADVANCED MATERIALS TECHNOLOGIES, v.8, no.5, pp.1-8 5 원문
Journal 2017 Thermal Conductivity and Thermal Boundary Resistances of ALD Al2O3 Films on Si and Sapphire   Lee Seung Min  International Journal of Thermophysics, v.38, no.12, pp.1-10 7 원문
특허 검색결과
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연구보고서 검색결과
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