Subjects : Etching selectivity
Type | Year | Title | Cited | Download |
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Journal | 2017 | Large Size of Capacitive Window-Unified TSP Using by Contact Hole Type as an Insulator Seo Woo Hyung Journal of Nanoscience and Nanotechnology, v.17, no.5, pp.3089-3091 | 0 | 원문 |
Journal | 2014 | Bottom‐inlet‐type micro‐electro‐mechanical system acoustic sensors based on two polyimide/amorphous‐Si sacrificial layers Jaewoo Lee IET Micro & Nano Letters, v.9, no.12, pp.845-849 | 1 | 원문 |
Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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Type | Year | Research Project | Primary Investigator | Download |
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