Subjects : Hybrid bonding
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2023 | Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 | 6 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
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| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
| Annual Report | 2022 | PIM 2.5D Large-Scale Super-Performance Interposer and 3D Hybrid Bonding Platform for PIM Seimconductor integrating Processors and High-Bandwidth Memories | Kwon Young-Su |