Subjects : Thermal and mechanical properties
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2018 | Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste Inhoo Kim International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4 | ||
| Journal | 2018 | Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging Keonsoo Jang Polymer International, v.67, no.9, pp.1241-1247 | 24 | 원문 |
| Conference | 2014 | Structural Dependence of Thermal and Mechanical Properties of Ge-Sb-Se Chalcogenide Glass for Use in Molded Lens Applications International Symposium on Non-Oxide and New Optical Glasses (ISNOG) 2014, pp.1-1 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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