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Conference
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2025 |
Environmentally Friendly Cu Post Technology Based on Laser-Assisted Bonding with Compression (LABC) and Fume-Free Laser Solder Paste for Advanced 3D Interconnections
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2025, pp.1952-1957 |
0 |
원문
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Journal
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2014 |
Performance Improvements of Pouch-Type Flexible Thin-Film Lithium-Ion Batteries by Modifying Sequential Screen-Printing Process
Kang Kunyoung Electrochimica Acta, v.138, pp.294-301 |
44 |
원문
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Conference
|
2007 |
Novel Process for the Electrodes of Microbolometer
Ryu Hojun International Conference on Sensor Technologies and Applications (SENSORCOMM) 2007, pp.10-13 |
1 |
원문
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