|
Conference
|
2015 |
Electromagnetic Interference Characteristics into the Air by a Buried Conductor as a Secondary ELF Line Source
Sangmu Lee International Symposium on Electromagnetic Compatibility (EMC Europe) 2015, pp.1402-1405 |
|
|
|
Conference
|
2014 |
On the Statistical Characteristics of Power Balance Approach: Theoretical Study
Lee Young Seung European Conference on Antennas and Propagation (EuCAP) 2014, pp.1155-1157 |
0 |
원문
|
|
Conference
|
2002 |
The effect of via size on fine pitch and high density solder bumps for wafer level packaging
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2002, pp.1178-1181 |
|
원문
|