Subjects :
Maximum temperature
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
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2022 |
Experimental phantom test of 925 MHz microwave energy focusing for non-invasive local thermotherapy
Lee Kwang Jae Results in Physics, v.38, pp.1-3 |
7 |
원문
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Conference
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2021 |
Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material
Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 |
5 |
원문
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|
Conference
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2020 |
Thermal analysis of power module using high heat dissipation substrate and bonding material
Donghwan Kim 대한전자공학회 학술 대회 (하계) 2020, pp.151-154 |
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Conference
|
2018 |
Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste
Inhoo Kim International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4 |
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Journal
|
2006 |
Bone Temperature Estimation During Orthopaedic Round Bur Milling Operations
Shin Hochul Journal of Biomechanics, v.39, no.1, pp.33-39 |
78 |
원문
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특허 검색결과
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Year |
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Family Pat. |
KIPRIS |
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연구보고서 검색결과
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