Subjects : Multilevel interconnection
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 1996 | Planarised Interconnection Technology using a New Pillar Formation Method with Multi-Stacked Metal Structure Min Park Electronics Letters, v.32, no.18, pp.1731-1732 | 4 | 원문 |
| Conference | 1996 | Multilevel Interconnection Technology using New Pillar Formation Method and CMP Planarization Min Park International Chemical-Mechanical Polish for VLSI/ULSI Multilevel Interconnection Conference (CMP-MIC) 1996, pp.291-298 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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