Subjects : Integrated process
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2012 | Thin MEMS microphone based on package-integrated fabrication process Jaewoo Lee Electronics Letters, v.48, no.14, pp.866-867 | 5 | 원문 |
| Conference | 2009 | A Surface-Micromachined MEMS Acoustic Sensor with X-Shape Bottom Electrode Anchor Jaewoo Lee SENSORS 2009, pp.1313-1316 | 12 | 원문 |
| Conference | 2008 | Surface-Micromachined Deep Back Chamber MEMS Acoustic Sensor Using Two Sacrificial Layers Jaewoo Lee SENSORS 2008, pp.569-572 | 5 | 원문 |
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| Type | Year | Research Project | Primary Investigator | Download |
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