Subjects : chip package
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2014 | Development of a Heat Pipe Heat Dissipation Method for CPV Application Moon Seok-Hwan International Conference on Concentrator Photovoltaic Systems (CPV) 2014, pp.140-143 | 4 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2022 | APPARATUS AND METHOD FOR ZQ CALIBRATION OF DATA TRANSMISSION DRIVING CIRCUIT IN MEMORY CHIP PACKAGE OF MULTI-MEMORY DIE STRUCTURE | UNITED STATES | ||
| Registered | 2022 | 복수의 메모리 다이 구조의 메모리 칩 패키지에서 데이터 전송 구동 회로의 출력 임피던스 보정 장치 및 방법 | KOREA |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
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