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Registered 복수의 메모리 다이 구조의 메모리 칩 패키지에서 데이터 전송 구동 회로의 출력 임피던스 보정 장치 및 방법

Inventors
조민형, 전영득, 한진호
Application No.
2022-0094950 (2022.07.29)
Registration No.
2826309 (2025.06.24)
Country
KOREA
Project Code
21HS3200, Development of LPDDR5 memory interface for AI application processor, Young-Deuk Jeon
KSP Keywords
Data transmission, Die structure, Driving circuit, Memory chip, chip package
Family
 
패밀리 특허 목록
Status Patent Country KIPRIS
Registered APPARATUS AND METHOD FOR ZQ CALIBRATION OF DATA TRANSMISSION DRIVING CIRCUIT IN MEMORY CHIP PACKAGE OF MULTI-MEMORY DIE STRUCTURE UNITED STATES
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