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Conference
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2025 |
Localized Formation of Laser Non-conductive Film (NCF) on 10 μm Diameter Bumps, Applied to 20 μm Pitch Chiplet Chip-on-Wafer (CoW) Bonding
Shin Jungho Electronic Components and Technology Conference (ECTC) 2025, pp.1-6 |
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Conference
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2024 |
Chip-on-Wafer (CoW) Technology Utilizing LaserAssisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20m Pitch
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2024, pp.943-948 |
2 |
원문
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Conference
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2023 |
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 |
5 |
원문
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