Subjects : Interfacial reliability
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2022 | A Study on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on DBC/AMB Substrates for Power Module Son Kirak 한국반도체 학술대회 (KCS) 2022, pp.369-369 | ||
| Conference | 2021 | Effect of Sintering Process on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on Power Electronics Substrate Son Kirak International Symposium on Microelectronics and Packaging (ISMP) 2021, pp.1-1 |
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| Type | Year | Research Project | Primary Investigator | Download |
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