Subjects :
High-Productivity
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
|
2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 |
|
원문
|
|
Journal
|
2014 |
Scientists and Engineers in Convergence Technologies in Korea: Where Are They Going and How Do They Collaborate?
이정만 Technological and Economic Development of Economy, v.20, no.3, pp.434-456 |
5 |
원문
|
|
Journal
|
2014 |
Thermal Analysis and Testing of a Heat Pipe With Woven Wired Wick
Moon Seok-Hwan IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.6, pp.991-998 |
6 |
원문
|
|
Journal
|
2001 |
Experimental study on the performance of miniature heat pipes with woven-wire wick
Moon Seok-Hwan IEEE Transactions on Components and Packaging Technologies, v.24, no.4, pp.591-595 |
17 |
원문
|
특허 검색결과
| Status |
Year |
Patent Name |
Country |
Family Pat. |
KIPRIS |
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