Subjects : 3D stacking
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2025 | Fine-Pitch Flip-Chip Bonding Process with Laser Non-Conductive Paste (NCP) and Laser-Assisted Bonding (LAB) for High-Reliability Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2025, pp.1-5 | 0 | 원문 |
| Conference | 2025 | A Novel Photo-Patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-Chip Interconnections Gwang-Mun Choi European Microelectronics and Packaging Conference (EMPC) 2025, pp.1-5 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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