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Journal
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2022 |
Thermal shock reliability of micro–nano bimodal Cu–Ag sintered joints
Son Kirak Journal of Materials Science : Materials in Electronics, v.33, pp.17493-17501 |
2 |
원문
|
|
Journal
|
2016 |
Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate
Bae Hyun-Cheol Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 |
2 |
원문
|
|
Journal
|
2011 |
Dual Etch Processes of Via and Metal Paste Filling for Through Silicon Via Process
함용현 Thin Solid Films, v.519, no.20, pp.6727-6731 |
26 |
원문
|