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Conference
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2017 |
Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
0 |
원문
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Journal
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2016 |
Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications
Eom Yong Sung ETRI Journal, v.38, no.6, pp.1179-1189 |
5 |
원문
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Conference
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2010 |
A Carbon Nanotube Field Emitter Formed on W-wire with High Current Density for X-ray Source
Kang Jun Tae International Vacuum Electron Sources Conference and Nanocarbon (IVESC) 2010, pp.313-314 |
3 |
원문
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Conference
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2006 |
Highly Reliable CNT Emitters with Enhanced Adhesion to Cathode Electrode
Kim Dae Jun International Symposium, Seminar and Exhibition (SID) 2006, pp.659-662 |
0 |
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