Subjects : viscosity measurement
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2016 | Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications Eom Yong Sung ETRI Journal, v.38, no.6, pp.1179-1189 | 5 | 원문 |
| Conference | 2014 | Flip-Chip Bonding Processes with Low Volume SoP Technology Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 | 0 | 원문 |
| Journal | 2013 | Optimization of Material and Process for Fine Pitch LVSoP Technology Eom Yong Sung ETRI Journal, v.35, no.4, pp.625-631 | 21 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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