Subjects : Redistribution layer
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2024 | The Energy-Efficient 10-Chiplet AI Hyperscale NPU on Large-Scale Advanced Package 윤지원 Electronic Components and Technology Conference (ECTC) 2024, pp.1687-1693 | 3 | 원문 |
| Conference | 2017 | Silica Filler Content in NCP and its Effects on the Reliability of 3D TSV Multi-Stack under Thermal Shock Test 주니어 Electronics Packaging Technology Conference (EPTC) 2017, pp.1-8 | 8 | 원문 |
| Conference | 2010 | 3D SiP Module using TSV and Novel Solder Bump Maker Bae Hyun-Cheol Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 | 5 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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