Subjects : rheological behavior
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2012 | Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 | 2 | 원문 |
| Conference | 2010 | 3D SiP Module using TSV and Novel Solder Bump Maker Bae Hyun-Cheol Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 | 5 | 원문 |
| Conference | 2009 | Novel Bumping Material for Stacking Silicon Chips Choi Kwang-Seong Electronics Packaging Technology Conference (EPTC) 2009, pp.579-583 | 2 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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