Subjects : Multi-layer substrate
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2021 | Switching and Heat-dissipation Performance Analysis of an LTCC-based Leadless Surface Mount Package Using a Power Factor Correction Converter Jung Dong Yun International Conference on Electronics, Information and Communication (ICEIC) 2021, pp.811-813 | 2 | 원문 |
| Conference | 2016 | Multi-layer Substrate Based Power Semiconductor Package for Low Parasitic Inductance and High Heat Transfer Jung Dong Yun Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD) 2016, pp.283-285 |
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| Type | Year | Research Project | Primary Investigator | Download |
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